Loading...

THS3092DDAG4

Texas Instruments

THS3092DDAG4 by Texas Instruments

THS3092DDAG4 by Texas Instruments is a dual operational amplifier with 8 terminals in a small outline package. It features industrial temperature grade, Gull Wing terminal form, and 1.27mm pitch. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,430

-

-

-

-

Digiode

USA . 693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

693

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,139 parts In-Stock

1+ parts

$2.211

100+ parts

-

1k+ parts

$2.718

10k+ parts

-

1,139

$2.211

-

$2.718

-

DigiPath Technology Company

USA . 1,105 parts In-Stock

1+ parts

$2.434

100+ parts

-

1k+ parts

-

10k+ parts

-

1,105

$2.434

-

-

-

ChromeModa Solutions

Germany . 4,511 parts In-Stock

1+ parts

$2.484

100+ parts

$2.037

1k+ parts

-

10k+ parts

-

4,511

$2.484

$2.037

-

-

IDEA Electronic Components Group

UK . 320 parts In-Stock

1+ parts

$2.484

100+ parts

-

1k+ parts

$2.236

10k+ parts

-

320

$2.484

-

$2.236

-

One Stop Electronics

USA . 1,133 parts In-Stock

1+ parts

$7.410

100+ parts

-

1k+ parts

-

10k+ parts

-

1,133

$7.410

-

-

-

AZTECH Wire

Italy . 389 parts In-Stock

1+ parts

$12.309

100+ parts

-

1k+ parts

-

10k+ parts

-

389

$12.309

-

-

-

Corphita

USA . 3,498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,498

-

-

-

-

Microchip USA

USA . 467 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

467

-

-

-

-

Overview

Elevate your electronic designs with the THS3092DDAG4 by Texas Instruments, a top-tier manufacturer known for delivering premium quality operational amplifiers (Op Amps). This compact and versatile device offers customers unparalleled value, providing high-performance solutions for a wide range of applications. With its advanced features and superior design, the THS3092DDAG4 is the ideal choice for those seeking reliability, precision, and efficiency in their projects. Experience the exceptional benefits and advantages this product has to offer, and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the operational amplifier, ensuring long-term reliable performance.

Surface Mount: YES

The surface mount capability makes installation and integration of this operational amplifier easy and efficient, saving time and effort.

No. of Functions: 2

Having 2 functions allows for versatile use and application of the operational amplifier, making it suitable for a wide range of electronic projects.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to mount and integrate into electronic circuits or devices.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the operational amplifier to other components or devices, allowing for customization and specific circuit configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

The small outline, heat sink/slug, and low profile package style ensures efficient heat dissipation and space-saving design, making it ideal for compact electronic devices.

Terminal Position: DUAL

The dual terminal position allows for multiple connection options, enhancing the flexibility and adaptability of the operational amplifier in various circuit layouts.

Maximum Seated Height: 1.68 mm

The low seated height of 1.68 mm enables compact and slim device designs, reducing overall size and improving space efficiency.

Width: 3.9 mm

The narrow width of 3.9 mm allows for easy placement and integration of the operational amplifier in tight spaces or crowded circuit layouts.

Length: 4.89 mm

The short length of 4.89 mm further enhances the compactness and space-saving features of the operational amplifier, making it suitable for small electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in a wide range of temperature environments, making it suitable for industrial applications and harsh operating conditions.

Terminal Form: GULL WING

The gull wing terminal form provides secure and stable connections, reducing the risk of disconnection or signal loss in the operational amplifier.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is designed for high input impedance, low output impedance, and differential voltage amplification, making it ideal for signal processing and amplification applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and standardized connections, improving compatibility and ease of use in various circuit configurations.

Technical Specifications

Operational Amplifiers (Op Amps) THS3092DDAG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.89 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.066 in (1.68 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Low Profile

Trade Compliance

THS3092DDAG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20