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THS1206M-EVM

Texas Instruments

THS1206M-EVM by Texas Instruments

THS1206M-EVM by Texas Instruments is a 12-bit ADC Evaluation Board with 6MSPS sampling rate, operating at 186mW power. It features a parallel data interface and input range of 1.5-3.5V, utilizing THS1206M IC for Development Boards and Kits applications.

Median Price

$599.990

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 16 parts In-Stock

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$99.990

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DigiKey

USA . 1 parts In-Stock

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$599.990

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Mouser Electronics

USA . 1 parts In-Stock

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$600.020

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Digiode

USA . 1,468 parts In-Stock

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$94.990

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Vyrian

USA . 5,808 parts In-Stock

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Semicontronic

India . 7 parts In-Stock

1+ parts

$84.990

100+ parts

$82.865

1k+ parts

$82.440

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7

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$82.865

$82.440

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Corphita

USA . 3,860 parts In-Stock

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$89.991

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Corohmni

South Africa . 68 parts In-Stock

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$99.990

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68

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ChromeModa Solutions

Germany . 5,784 parts In-Stock

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IDEA Electronic Components Group

UK . 1,955 parts In-Stock

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Parana Technologies

USA . 1,898 parts In-Stock

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$0.792

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1,898

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$0.792

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DigiPath Technology Company

USA . 950 parts In-Stock

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950

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Overview

Unleash the power of precision with the THS1206M-EVM by Texas Instruments. Crafted by a renowned manufacturer, this development board offers unparalleled performance in ADC evaluation. With a 12-bit resolution and a sampling rate of 6M per second, this board provides high-quality data conversion for a wide range of applications. Whether you're working on industrial automation or medical imaging, the THS1206M-EVM delivers exceptional value, accuracy, and reliability to meet your project needs. Elevate your design process with this cutting-edge tool and experience the difference for yourself.

Feature Benefit Bullets

Other Names

Having multiple names makes it easier to find and cross-reference this product in different catalogs or databases.

Category

This product falls under multiple categories, indicating its versatility and potential for various applications.

Package

Bulk packaging typically means cost-efficiency for ordering in larger quantities.

Number of Bits

A higher number of bits typically indicates a higher resolution and more accurate conversion.

Sampling Rate (Per Second)

A high sampling rate allows for capturing fast-changing analog signals accurately.

Data Interface

Parallel interfaces provide faster data transfer compared to serial interfaces, which can be beneficial for high-speed applications.

Input Range

A wide input range allows for flexibility in accommodating different signal levels without the need for external signal conditioning.

Power (Typ) @ Conditions

Low power consumption at the specified conditions can be advantageous for energy-efficient designs.

Utilized IC / Part

Utilization of a specific integrated circuit indicates optimized performance and compatibility with the specified component.

Supplied Contents

The provision of necessary board(s) simplifies the setup process and enables immediate use for evaluation or development.

Base Product Number

Having a base product number enables easy identification and differentiation within a product line or series.

Moisture Sensitivity Level (MSL)

A low moisture sensitivity level indicates that the product is resilient to moisture-related issues during storage or handling.

Technical Specifications

Additional Parts THS1206M-EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

-296-16737-ND
-296-16737-NDR
-THS1206M
296-16737-NDR
-THS1206M-EVM-NDR
-296-16737
THS1206MEVM
296-16737

Category:

Development Boards, Kits, Programmers
Evaluation Boards Analog to Digital Converters (ADCs) Evaluation Boards

Number of A/D Converters:

1

Data Interface:

Parallel

Standard Package:

1

Supplied Contents:

Board(s)

Input Range:

1.5 ~ 3.5V

Number of Bits:

12

Utilized IC / Part:

THS1206M

Package:

Bulk

Sampling Rate (Per Second):

6M

Power (Typ) @ Conditions:

186mW @ 5V AVdd, 3.3V DVdd

Base Product Number:

THS1206

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

THS1206M-EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991C2

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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