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TFP501PZPG4

Texas Instruments

TFP501PZPG4 by Texas Instruments

TFP501PZPG4 by Texas Instruments is a 3.3V CONSUMER CIRCUIT IC with 100 terminals in a SQUARE package. It operates b/w 0-70°C, has a supply voltage range of 3-3.6V, and supports a max current of 460mA. Ideal for consumer electronics applications requiring compact, high-performance ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,503

-

-

-

-

Digiode

USA . 1,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,861

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,112 parts In-Stock

1+ parts

$1.437

100+ parts

-

1k+ parts

$2.128

10k+ parts

-

2,112

$1.437

-

$2.128

-

DigiPath Technology Company

USA . 21 parts In-Stock

1+ parts

$1.583

100+ parts

$1.456

1k+ parts

-

10k+ parts

-

21

$1.583

$1.456

-

-

ChromeModa Solutions

Germany . 2,815 parts In-Stock

1+ parts

$1.615

100+ parts

$1.324

1k+ parts

-

10k+ parts

-

2,815

$1.615

$1.324

-

-

IDEA Electronic Components Group

UK . 1,951 parts In-Stock

1+ parts

$1.615

100+ parts

-

1k+ parts

$1.454

10k+ parts

-

1,951

$1.615

-

$1.454

-

One Stop Electronics

USA . 1,520 parts In-Stock

1+ parts

$8.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,520

$8.800

-

-

-

AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$19.599

100+ parts

-

1k+ parts

-

10k+ parts

-

253

$19.599

-

-

-

Corphita

USA . 4,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,722

-

-

-

-

Overview

Experience unparalleled quality and innovation with the TFP501PZPG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge consumer ICs like the TFP501PZPG4 that offer reliable performance and versatility. This product is perfect for a wide range of applications, providing customers with exceptional value and benefits. Trust Texas Instruments to provide you with top-of-the-line technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures a lightweight and durable design, making it suitable for consumer electronics applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and facilitating mass production.

Power Supplies (V): 3.3

Operating at a low power supply voltage of 3.3V helps in reducing power consumption, making it energy-efficient and cost-effective.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within a specified temperature range, making it suitable for typical consumer electronic devices.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, enhancing the product's efficiency and versatility.

Technical Specifications

Other Function Consumer ICs TFP501PZPG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

460 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TFP501PZPG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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