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TDES954RGZR

Texas Instruments

TDES954RGZR by Texas Instruments

TDES954RGZR by Texas Instruments is a Line Receiver IC with 48 terminals, operating at -20 to 85 °C. It features inverted output polarity, differential input characteristics, and open-drain output. Ideal for applications requiring a max supply voltage of 1.89 V and a min supply voltage of 1.71 V in surface-mount designs.

Median Price

$6.477

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,758 parts In-Stock

1+ parts

$6.477

100+ parts

$5.280

1k+ parts

$3.520

10k+ parts

-

18,758

$6.477

$5.280

$3.520

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,488 parts In-Stock

1+ parts

$6.153

100+ parts

-

1k+ parts

-

10k+ parts

-

4,488

$6.153

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-

-

Vyrian

USA . 8,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,358

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,358 parts In-Stock

1+ parts

$5.829

100+ parts

-

1k+ parts

-

10k+ parts

-

2,358

$5.829

-

-

-

Parana Technologies

USA . 1,545 parts In-Stock

1+ parts

$9.740

100+ parts

-

1k+ parts

$10.319

10k+ parts

-

1,545

$9.740

-

$10.319

-

DigiPath Technology Company

USA . 4 parts In-Stock

1+ parts

$10.725

100+ parts

$9.867

1k+ parts

-

10k+ parts

-

4

$10.725

$9.867

-

-

ChromeModa Solutions

Germany . 1,061 parts In-Stock

1+ parts

$10.944

100+ parts

$8.974

1k+ parts

-

10k+ parts

-

1,061

$10.944

$8.974

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IDEA Electronic Components Group

UK . 957 parts In-Stock

1+ parts

$10.944

100+ parts

$10.397

1k+ parts

$9.850

10k+ parts

-

957

$10.944

$10.397

$9.850

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AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$21.320

100+ parts

-

1k+ parts

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437

$21.320

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QUARKTWIN TECHNOLOGY LTD

USA . 6,408 parts In-Stock

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6,408

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Overview

Elevate your electronics projects with the TDES954RGZR by Texas Instruments. Crafted with precision and expertise, this high-quality line receiver offers unparalleled performance and reliability. Whether you're working on industrial automation, telecommunications, or automotive systems, this chip carrier with very thin profile has got you covered. Say goodbye to worries about input current and output polarity, as this nickel palladium gold-finished product boasts inverted output characteristics and differential input capabilities. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations. Choose the TDES954RGZR for seamless integration and exceptional results in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for better longevity and ease of handling.

Surface Mount: YES

Allows for easy and space-saving installation on circuit boards.

Maximum Supply Voltage: 1.89 V

Can handle higher voltages for robust performance.

Package Shape: SQUARE

Compact shape for efficient use of space in electronic devices.

No. of Terminals: 48

Sufficient terminals for versatile connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package style with heat dissipation capabilities and slim profile.

Maximum High Level Input Current: 0.00019 Amp

Efficient input current handling for reliable signal processing.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage for energy efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for versatile usage scenarios.

Output Characteristics: OPEN-DRAIN

Open-drain output for easy interfacing with other components.

Minimum Operating Temperature: -20 °C

Can operate in low-temperature environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for reliable connections.

Terminal Position: QUAD

Quad terminal configuration for better signal integrity.

Maximum Seated Height: 1 mm

Low seated height for slim device designs.

Width: 7 mm

Compact width for space-saving installation.

Maximum Output Low Current: 0.035 Amp

Can handle low output currents efficiently.

Output Polarity: INVERTED

Inverted output polarity for specific application requirements.

Differential Output: YES

Differential output for noise immunity and signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for manufacturing processes.

Length: 7 mm

Compact length for efficient use of space on circuit boards.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance.

Maximum Supply Current: 279 mA

Can handle higher supply currents for robust performance.

Input Characteristics: DIFFERENTIAL

Differential input for noise rejection and signal accuracy.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout designs.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard handling precautions.

Interface IC Type: LINE RECEIVER

Specifically designed for line receiving applications.

Technical Specifications

Line Drivers & Receivers TDES954RGZR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Maximum High Level Input Current:

.00019 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Output Characteristics:

OPEN-DRAIN

Maximum Output Low Current:

.035 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Maximum Supply Current:

279 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TDES954RGZR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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