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TC1-DESIQ-SBB/NOPB

Texas Instruments

TC1-DESIQ-SBB/NOPB by Texas Instruments

TC1-DESIQ-SBB/NOPB by Texas Instruments is a Balun type RF Evaluation Kit with frequency range of 4.5MHz to 3GHz. It is designed for use with ADC1xD1x00RB and comes in a Box package. Ideal for Development Boards, Kits, Programmers and Evaluation Boards applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,958 parts In-Stock

1+ parts

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8,958

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Digiode

USA . 3,124 parts In-Stock

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3,124

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 859 parts In-Stock

1+ parts

$8.207

100+ parts

-

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859

$8.207

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Semicontronic

India . 750 parts In-Stock

1+ parts

$17.100

100+ parts

$16.672

1k+ parts

$16.587

10k+ parts

-

750

$17.100

$16.672

$16.587

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Ampacity Inc.

Singapore . 300 parts In-Stock

1+ parts

$69.100

100+ parts

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300

$69.100

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One Stop Electronics

USA . 589 parts In-Stock

1+ parts

$223.100

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589

$223.100

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ChromeModa Solutions

Germany . 4,813 parts In-Stock

1+ parts

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4,813

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Corphita

USA . 2,182 parts In-Stock

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2,182

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Parana Technologies

USA . 1,386 parts In-Stock

1+ parts

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100+ parts

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$0.240

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1,386

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$0.240

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IDEA Electronic Components Group

UK . 1,230 parts In-Stock

1+ parts

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1,230

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Corohmni

South Africa . 406 parts In-Stock

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406

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DigiPath Technology Company

USA . 286 parts In-Stock

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286

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Overview

Discover the unmatched quality and reliability of the TC1-DESIQ-SBB/NOPB by Texas Instruments, a top-of-the-line balun board that offers seamless integration with ADC1xD1x00RB products. Perfect for RF evaluation and development, this versatile board is a game-changer in the world of electronics. With Texas Instruments' reputation for excellence and innovation, you can trust that this product will exceed your expectations. Experience the unparalleled performance and endless possibilities that the TC1-DESIQ-SBB/NOPB brings to your projects. Elevate your designs today with this exceptional offering from Texas Instruments.

Feature Benefit Bullets

Other Names: TC1DESIQSBBNOPB

This unique identifier helps differentiate the product from others in the market, making it easier to find and reference.

Category: Development Boards, Kits, Programmers / Evaluation Boards / RF Evaluation and Development Kits, Boards

This product falls under multiple categories, indicating its versatility and suitability for a range of applications in development and evaluation of RF technologies.

Package: Box

The box packaging provides protection for the product during transit and storage, ensuring it arrives in good condition for immediate use.

Type: Balun

The balun design helps in converting between balanced and unbalanced signals, allowing for efficient transfer of RF signals and minimizing signal loss.

Frequency: 4.5MHz ~ 3GHz

With a wide frequency range, this product is suitable for testing and development of RF systems operating within various frequency bands.

For Use With/Related Products: ADC1xD1x00RB

Compatibility with specific related products ensures seamless integration and optimal performance when used together.

Supplied Contents: Board(s)

The inclusion of board(s) provides essential components for testing and evaluation, making it a complete and convenient solution for RF development projects.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The unlimited MSL rating indicates that the product is not sensitive to moisture, ensuring reliability and consistent performance even in varied environmental conditions.

Technical Specifications

Additional Parts TC1-DESIQ-SBB/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TC1DESIQSBBNOPB

Type:

Balun

Category:

Development Boards, Kits, Programmers
Evaluation Boards RF Evaluation and Development Kits, Boards

For Use With/Related Products:

ADC1xD1x00RB

Supplied Contents:

Board(s)

Frequency:

4.5MHz ~ 3GHz

Package:

Box

Standard Package:

1

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TC1-DESIQ-SBB/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.90.6600

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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