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TAS5548EVM

Texas Instruments

TAS5548EVM by Texas Instruments

TAS5548EVM by Texas Instruments is an Audio Processing Evaluation Board for TAS5548 IC. It comes in a Box package and includes board(s). With MSL of 1, it's ideal for testing audio processing capabilities in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,849 parts In-Stock

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7,849

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Digiode

USA . 1,529 parts In-Stock

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1,529

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Distributors (Availability)

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AZTECH Wire

Italy . 195 parts In-Stock

1+ parts

$8.251

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195

$8.251

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Semicontronic

India . 414 parts In-Stock

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$17.100

100+ parts

$16.672

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$16.587

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414

$17.100

$16.672

$16.587

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Ampacity Inc.

Singapore . 496 parts In-Stock

1+ parts

$160.100

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496

$160.100

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One Stop Electronics

USA . 842 parts In-Stock

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$195.100

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842

$195.100

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Corphita

USA . 4,551 parts In-Stock

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4,551

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DigiPath Technology Company

USA . 2,354 parts In-Stock

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2,354

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IDEA Electronic Components Group

UK . 396 parts In-Stock

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396

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Parana Technologies

USA . 281 parts In-Stock

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$0.042

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281

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$0.042

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ChromeModa Solutions

Germany . 131 parts In-Stock

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Corohmni

South Africa . 96 parts In-Stock

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Overview

Enhance your audio processing projects with the TAS5548EVM by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality evaluation boards like this one, designed for development and demonstration in various applications. The TAS5548EVM offers unparalleled value and benefits to customers looking to optimize their audio systems, with easy integration and high-performance capabilities. Elevate your audio processing experience with the TAS5548EVM today.

Feature Benefit Bullets

Other Names: TAS5548EVM-ND, 296-43462

Having multiple names makes it easier to find and purchase this product from different sources.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Evaluation and Demonstration Boards and Kits

This product falls under various categories, indicating its versatility and wide range of applications.

Package: Box

The box packaging helps in safely storing and transporting the product, ensuring it remains in good condition.

Type: Audio

Designed specifically for audio applications, making it suitable for use in audio processing projects.

Function: Audio Processing

This product is tailored for audio processing tasks, ensuring high-quality sound output and signal processing capabilities.

Utilized IC / Part: TAS5548

The use of TAS5548 IC ensures compatibility and optimized performance within the audio processing circuit of this product.

Supplied Contents: Board(s)

The inclusion of boards in the package provides the necessary components for setting up and using the product effectively.

Base Product Number: TAS554

Indicates the base model number for easy identification and compatibility with other TAS554 series products.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The unlimited MSL level indicates that the product is not sensitive to moisture, ensuring its durability and reliability even in humid conditions.

Technical Specifications

Additional Parts TAS5548EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TAS5548EVM-ND
296-43462

Function:

Audio Processing

Type:

Audio

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

TAS5548

Package:

Box

Standard Package:

1

Base Product Number:

TAS554

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TAS5548EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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