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SNJ54HC161J

Texas Instruments

SNJ54HC161J by Texas Instruments

SNJ54HC161J by Texas Instruments is a 4-bit digital counter with a propagation delay of 46ns and operates at a supply voltage of 5V. It is designed for military-grade applications, featuring a max operating temperature of 125°C and a technology based on CMOS. The synchronous operation mode and positive edge trigger type make it suitable for high-speed counting applications up to 21MHz.

Median Price

$12.457

Lifecycle Status

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Chip1Stop

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NAC Semi

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American Microsemiconductor Inc.

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Classic Components Corporation

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Andel Nordic

Denmark . 3,583 parts In-Stock

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Parana Technologies

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ChromeModa Solutions

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IDEA Electronic Components Group

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AZTECH Wire

Italy . 245 parts In-Stock

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Overview

Unlock the power of precision and reliability with the SNJ54HC161J by Texas Instruments. As a leader in digital counters, Texas Instruments delivers unmatched quality and innovation. Ideal for a wide range of applications, this product offers customers the value of fast propagation delays, military-grade screening, and a seamless synchronous operation mode. Experience the benefits of efficiency and accuracy with the SNJ54HC161J - your solution for top-notch performance in any project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package provides durability and reliability, making it suitable for harsh environments.

Propagation Delay At Nominal Supply: 46 ns

Low propagation delay ensures quick response time and accurate counting.

Screening Level: MIL-PRF-38535

Compliance with MIL-PRF-38535 standards ensures high quality and reliability for military applications.

No. of Bits: 4

4 bits provide a wide range for counting applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with many systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for use in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Maximum Frequency At Nominal Supply: 21000000 Hz

High maximum frequency allows for fast counting operations.

Technical Specifications

Digital Counters SNJ54HC161J attributes and parameters. Explore more Digital Counters devices from Texas Instruments

Specs

Additional Features:

RCO OUTPUT

Count Direction:

UP

Family:

HC/UH

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

5.2 Amp

Operation Mode:

SYNCHRONOUS

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

46 ns

Propagation Delay (tpd):

310 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Counters

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

25 MHz

Trade Compliance

SNJ54HC161J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-313-2193, 5962013132193, 5962-01-244-9585, 5962012449585, 5962-01-240-9244, 5962012409244, 5962-01-275-6253, 5962012756253

NIIN

013132193, 012449585, 012409244, 012756253

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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