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SN75LVDS9637DRG4

Texas Instruments

SN75LVDS9637DRG4 by Texas Instruments

SN75LVDS9637DRG4 by Texas Instruments is a Line Driver & Receiver with 3.3V power supply, 8 terminals, and EIA-644 interface standard. It operates b/w 0 to 70°C, has a max output low current of 8A, and a max receive delay of 6ns. Ideal for differential input applications in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,183 parts In-Stock

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5,183

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Digiode

USA . 3,886 parts In-Stock

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3,886

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,227 parts In-Stock

1+ parts

$1.500

100+ parts

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1,227

$1.500

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Parana Technologies

USA . 2,232 parts In-Stock

1+ parts

$12.991

100+ parts

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1k+ parts

$13.483

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2,232

$12.991

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$13.483

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ChromeModa Solutions

Germany . 2,768 parts In-Stock

1+ parts

$14.597

100+ parts

$11.970

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2,768

$14.597

$11.970

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IDEA Electronic Components Group

UK . 621 parts In-Stock

1+ parts

$14.597

100+ parts

$13.867

1k+ parts

$13.137

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621

$14.597

$13.867

$13.137

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AZTECH Wire

Italy . 893 parts In-Stock

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$16.205

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893

$16.205

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Corphita

USA . 4,089 parts In-Stock

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4,089

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DigiPath Technology Company

USA . 1,108 parts In-Stock

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$13.161

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$13.161

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Microchip USA

USA . 221 parts In-Stock

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Overview

Unlock the power of high-quality communication with the SN75LVDS9637DRG4 by Texas Instruments. This cutting-edge line driver and receiver boasts superior performance and reliability, perfect for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product delivers unmatched value, benefits, and advantages to meet your needs. Say goodbye to communication disruptions and hello to seamless connectivity with the SN75LVDS9637DRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for portable or compact devices.

Surface Mount: YES

Easy to integrate into printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power options.

No. of Functions: 2

Offers multiple functions in a single component, reducing the need for additional chips.

Package Shape: RECTANGULAR

Standard shape for easy handling and placement on PCBs.

Power Supplies (V): 3.3

Common power supply voltage, widely compatible with other components.

No. of Terminals: 8

Sufficient terminals for connectivity and signal transmission.

Package Style (Meter): SMALL OUTLINE

Compact and space-saving design for efficient use of PCB real estate.

Minimum Supply Voltage: 3 V

Can operate with low supply voltages, conserving power.

Maximum Operating Temperature: 70 °C

Can operate in high-temperature environments, ensuring reliability.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments, suitable for various applications.

Terminal Position: DUAL

Dual terminal layout for enhanced signal integrity and robust connections.

Maximum Seated Height: 1.75 mm

Low profile design for slim devices or applications with height constraints.

Width: 3.9 mm

Compact width for efficient use of PCB space.

Maximum Output Low Current: 8 Amp

Capable of driving high current loads, suitable for demanding applications.

Receiver No. of Bits: 2

High-resolution signal reception with 2 bits, providing accurate data transmission.

Length: 4.9 mm

Optimal length for compact designs and efficient PCB layout.

Temperature Grade: COMMERCIAL

Designed for standard commercial operating temperatures.

Maximum Receive Delay: 6 ns

Low receive delay ensures fast data transmission for time-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals for secure soldering and reliable connections.

Interface Standard: EIA-644; TIA-644

Complies with industry standards for interoperability and compatibility.

Maximum Supply Current: 10 mA

Low power consumption with a maximum supply current of 10 mA.

Input Characteristics: DIFFERENTIAL

Differential input for noise rejection and improved signal quality.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance and reliability.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

Interface IC Type: LINE RECEIVER

Specific IC type designed for line reception applications, ensuring optimized performance.

Technical Specifications

Line Drivers & Receivers SN75LVDS9637DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN75LVDS9637DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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