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SN75LVDS388ADBTRG4

Texas Instruments

SN75LVDS388ADBTRG4 by Texas Instruments

SN75LVDS388ADBTRG4 by Texas Instruments is a CMOS Line Receiver with 8 functions, operating at 3.3V. It has a max supply voltage of 3.6V and operates in commercial temperature grade range of 0-70°C. Ideal for EIA-644/TIA-644 interface standard applications requiring differential input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,857 parts In-Stock

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6,857

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Digiode

USA . 4,641 parts In-Stock

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4,641

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Distributors (Availability)

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One Stop Electronics

USA . 1,237 parts In-Stock

1+ parts

$0.500

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1,237

$0.500

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Parana Technologies

USA . 2,302 parts In-Stock

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$6.435

100+ parts

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$7.179

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2,302

$6.435

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$7.179

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DigiPath Technology Company

USA . 539 parts In-Stock

1+ parts

$7.085

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539

$7.085

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ChromeModa Solutions

Germany . 5,390 parts In-Stock

1+ parts

$7.230

100+ parts

$5.929

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5,390

$7.230

$5.929

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IDEA Electronic Components Group

UK . 1,644 parts In-Stock

1+ parts

$7.230

100+ parts

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$6.507

10k+ parts

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1,644

$7.230

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$6.507

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AZTECH Wire

Italy . 1,480 parts In-Stock

1+ parts

$18.283

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1,480

$18.283

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Corphita

USA . 3,645 parts In-Stock

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Microchip USA

USA . 473 parts In-Stock

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Overview

Elevate your electronics with the SN75LVDS388ADBTRG4 by Texas Instruments. As a leader in quality manufacturing, Texas Instruments delivers exceptional Line Drivers & Receivers for a wide range of applications. This product offers customers unmatched value, benefits, and advantages, making it a must-have for any project requiring top-notch performance. Upgrade your circuitry today with the SN75LVDS388ADBTRG4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, ensuring reliable performance and longevity.

Surface Mount: YES

Being surface mountable makes installation and integration easier, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, offering flexibility in various applications.

No. of Functions: 8

With multiple functions in one device, it reduces the need for additional components, saving space and cost.

Package Shape: RECTANGULAR

The rectangular shape is commonly used and easy to handle during assembly and mounting.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage level, ensuring compatibility with most systems.

No. of Terminals: 38

Offers a sufficient number of terminals for connecting to other components or systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design saves space on the circuit board and allows for dense packing of components.

Minimum Supply Voltage: 3 V

Can operate at lower voltage levels, suitable for applications with limited power supply.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: 0 °C

Operates in a wide temperature range, ideal for both indoor and outdoor use.

Terminal Position: DUAL

Dual terminal position provides flexibility in connecting the device to the circuit.

Maximum Seated Height: 1.2 mm

Low profile design saves space and allows for compact layout on the PCB.

Width: 4.4 mm

Narrow width saves space on the PCB.

Maximum Output Low Current: 8 Amp

High output current capability ensures reliable signal transmission.

Receiver No. of Bits: 8

8-bit receiver provides accurate data transmission and reception.

Length: 9.7 mm

Compact length for efficient use of space on the PCB.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Maximum Receive Delay: 4 ns

Low receive delay ensures fast signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide secure attachment to the PCB.

Interface Standard: EIA-644; TIA-644

Compliance with industry standards ensures compatibility with other devices.

Maximum Supply Current: 40 mA

Low supply current requirement reduces power consumption.

Input Characteristics: DIFFERENTIAL

Differential inputs provide noise immunity and reliable signal integrity.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB.

Interface IC Type: LINE RECEIVER

Specifically designed for line reception, ensuring accurate data transmission.

Technical Specifications

Line Drivers & Receivers SN75LVDS388ADBTRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G38

Length:

9.7 mm

No. of Functions:

8

No. of Terminals:

38

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

8

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN75LVDS388ADBTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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