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SN75LVDS31PWRG4

Texas Instruments

SN75LVDS31PWRG4 by Texas Instruments

SN75LVDS31PWRG4 by Texas Instruments is a 3.3V CMOS LINE DRIVER with 4 functions, 16 terminals, and EIA-644 interface standard. It has a max transmit delay of 6ns and operates b/w 0 to 70°C. Ideal for applications requiring differential outputs in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,034 parts In-Stock

1+ parts

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6,034

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Digiode

USA . 4,577 parts In-Stock

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4,577

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 292 parts In-Stock

1+ parts

$3.564

100+ parts

-

1k+ parts

$4.086

10k+ parts

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292

$3.564

-

$4.086

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ChromeModa Solutions

Germany . 5,299 parts In-Stock

1+ parts

$4.004

100+ parts

$3.283

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5,299

$4.004

$3.283

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IDEA Electronic Components Group

UK . 732 parts In-Stock

1+ parts

$4.004

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$3.604

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732

$4.004

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$3.604

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One Stop Electronics

USA . 1,380 parts In-Stock

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$7.500

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1,380

$7.500

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AZTECH Wire

Italy . 630 parts In-Stock

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$16.364

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630

$16.364

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Corphita

USA . 2,742 parts In-Stock

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2,742

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DigiPath Technology Company

USA . 1,257 parts In-Stock

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$3.610

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$3.610

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Microchip USA

USA . 299 parts In-Stock

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299

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Overview

Enhance your electronic designs with the SN75LVDS31PWRG4 by Texas Instruments, a top-tier manufacturer known for innovative solutions in the Line Drivers & Receivers category. This high-quality product offers customers unparalleled value and benefits, with its advanced technology providing reliable signal transmission and reception. Ideal for a wide range of applications, this compact and efficient device ensures optimal performance and seamless connectivity in your projects. Trust Texas Instruments for cutting-edge solutions that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and making installation convenient.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V ensures compatibility with various voltage requirements in different applications.

No. of Functions: 4

Having multiple functions in one component reduces the need for additional components, simplifying the design and reducing costs.

Maximum Transmit Delay: 6 ns

With a low transmit delay of 6ns, the product provides fast signal transmission, making it suitable for high-speed data communication.

Power Supplies (V): 3.3

Operates on a standard power supply voltage of 3.3V, making it compatible with common power sources.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and signal routing options, increasing flexibility in circuit design.

Interface Standard: EIA-644; TIA-644

Compliance with EIA-644 and TIA-644 interface standards ensures compatibility with industry-standard communication protocols.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing overall performance.

Differential Output: YES

Differential output helps reduce noise and crosstalk, improving signal integrity in communication systems.

Technical Specifications

Line Drivers & Receivers SN75LVDS31PWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

6 ns

Width:

4.4 mm

Trade Compliance

SN75LVDS31PWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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