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SN75LVDS179DR

Texas Instruments

SN75LVDS179DR by Texas Instruments

SN75LVDS179DR by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 6ns max transmit delay, and 8 terminals. It is used in EIA-644/TIA-644 interfaces for differential input characteristics, offering a small outline package style suitable for commercial temperature grades applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,439 parts In-Stock

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Digiode

USA . 920 parts In-Stock

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AZTECH Wire

Italy . 509 parts In-Stock

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$5.192

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509

$5.192

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Parana Technologies

USA . 1,276 parts In-Stock

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$6.751

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$7.420

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DigiPath Technology Company

USA . 282 parts In-Stock

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$7.433

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ChromeModa Solutions

Germany . 3,062 parts In-Stock

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$7.585

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$6.220

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IDEA Electronic Components Group

UK . 326 parts In-Stock

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$7.585

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$6.826

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One Stop Electronics

USA . 1,473 parts In-Stock

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$44.500

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Component Stockers USA

USA . 353 parts In-Stock

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$99.990

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Corphita

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A-Z Elektronik GmbH

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Microchip USA

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Overview

Enhance your electronic designs with the SN75LVDS179DR Line Driver & Receiver from Texas Instruments. With a reputation for superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact rectangular package. This versatile component is perfect for a wide range of applications, providing fast data transmission and low power consumption. Upgrade your projects with the SN75LVDS179DR and experience seamless performance and enhanced efficiency like never before. Choose Texas Instruments for unmatched value and innovation in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can operate in a wide range of voltage levels, providing flexibility in different systems.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB, enabling compact designs.

Maximum Transmit Delay: 6 ns

Low transmit delay ensures fast and reliable data transmission, critical for high-speed applications.

Power Supplies (V): 3.3

Operating at a common power supply voltage of 3.3V makes integration with other components in the system easier.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for interfacing with other components or systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, allowing for more compact and efficient designs.

Maximum High Level Input Current: 0.00002 Amp

Low input current ensures minimal power consumption, making the product energy-efficient.

Minimum Supply Voltage: 3 V

Ability to operate at low supply voltage levels allows for compatibility with a wide range of systems and applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliability in harsh environmental conditions or extended operation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in cold environments without performance degradation.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable connections, reducing the risk of signal loss or interruption.

Maximum Seated Height: 1.75 mm

Low seated height allows for a slim and compact profile, making it suitable for space-constrained applications.

Width: 3.9 mm

Narrow width enables efficient use of PCB space, accommodating other components for a densely populated design.

Maximum Output Low Current: 8 Amp

High output current capability allows for driving demanding loads without the need for additional amplification circuits.

Differential Output: YES

Differential output improves noise immunity and signal integrity, making the product suitable for high-noise environments.

Length: 4.9 mm

Compact length enables a space-saving design, ideal for applications where size constraints are a consideration.

Minimum Out Swing: 0.247 V

Low minimum output swing ensures compatibility with a wide range of receiving devices, enabling seamless communication.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard operating conditions, suitable for most commercial applications.

Maximum Receive Delay: 6 ns

Low receive delay allows for quick processing of incoming data, ensuring efficient communication and response time.

Terminal Form: GULL WING

Gull wing terminal form provides secure and robust connections, reducing the risk of intermittent connections or signal loss.

Interface Standard: EIA-644; TIA-644

Compliance with EIA-644 and TIA-644 standards ensures interoperability and compatibility with a wide range of systems and devices.

Maximum Supply Current: 12 mA

Low supply current consumption ensures energy efficiency and prolongs battery life in portable or low-power applications.

Input Characteristics: DIFFERENTIAL

Differential input characteristics improve noise immunity and signal quality, making the product suitable for high-interference environments.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard voltage levels used in many electronic systems.

Terminal Pitch: 1.27 mm

Compact terminal pitch allows for high-density mounting on the PCB, maximizing space efficiency and connectivity options.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver IC type, this product can handle both transmitting and receiving signals efficiently, making it versatile for various communication applications.

Technical Specifications

Line Drivers & Receivers SN75LVDS179DR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

.247 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

6 ns

Width:

3.9 mm

Trade Compliance

SN75LVDS179DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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