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SN75LV4737ADBRG4

Texas Instruments

SN75LV4737ADBRG4 by Texas Instruments

SN75LV4737ADBRG4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V max supply voltage. It features a transmit delay of 850ns and is ideal for EIA-232-F, TIA-232-F, V.11 interfaces in commercial temperature grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 4,933 parts In-Stock

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Vyrian

USA . 2,535 parts In-Stock

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Prism Electronics

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Elcom Components

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One Stop Electronics

USA . 1,083 parts In-Stock

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$3.500

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Parana Technologies

USA . 205 parts In-Stock

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ChromeModa Solutions

Germany . 3,673 parts In-Stock

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IDEA Electronic Components Group

UK . 1,853 parts In-Stock

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AZTECH Wire

Italy . 563 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Microchip USA

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DigiPath Technology Company

USA . 1,894 parts In-Stock

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Perfect Parts

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Overview

Experience unparalleled reliability and performance with the SN75LV4737ADBRG4 by Texas Instruments, a leading manufacturer in the industry. This innovative line driver and receiver offers exceptional quality and precision, making it the ideal choice for a wide range of applications. From communication systems to industrial automation, this product provides unmatched value, benefits, and advantages to customers seeking dependable and efficient solutions. Trust Texas Instruments and elevate your projects with the SN75LV4737ADBRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the line driver & receiver.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on a PCB.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 3

Having multiple functions in a single device helps in simplifying circuit design and reducing component count.

Maximum Transmit Delay: 850 ns

Fast transmit delay ensures timely data transfer, suitable for high-speed communication.

Power Supplies (V): 3.3/5

Supports multiple power supply options for flexibility in different system configurations.

Temperature Grade: COMMERCIAL

Suitable for commercial temperature range applications, ensuring reliable performance in standard operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient signal processing.

Interface Standard: EIA-232-F; TIA-232-F; V.11

Compliant with industry-standard interface protocols, ensuring compatibility with a wide range of systems.

Technical Specifications

Line Drivers & Receivers SN75LV4737ADBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.11

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10.5 V

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

2 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

200 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

850 ns

Width:

5.3 mm

Trade Compliance

SN75LV4737ADBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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