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SN75LV4737ADBRE4

Texas Instruments

SN75LV4737ADBRE4 by Texas Instruments

SN75LV4737ADBRE4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.3/5V. It features a max transmit delay of 850ns and output polarity is complementary. Ideal for EIA-232-F, TIA-232-F, V.11 interfaces in commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,633 parts In-Stock

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3,633

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Digiode

USA . 1,775 parts In-Stock

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1,775

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Distributors (Availability)

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Parana Technologies

USA . 1,314 parts In-Stock

1+ parts

$6.815

100+ parts

$632.851

1k+ parts

$6.133

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1,314

$6.815

$632.851

$6.133

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DigiPath Technology Company

USA . 1,476 parts In-Stock

1+ parts

$7.504

100+ parts

$6.904

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1,476

$7.504

$6.904

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IDEA Electronic Components Group

UK . 1,425 parts In-Stock

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$7.657

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$6.891

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1,425

$7.657

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$6.891

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ChromeModa Solutions

Germany . 523 parts In-Stock

1+ parts

$7.657

100+ parts

$6.279

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523

$7.657

$6.279

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One Stop Electronics

USA . 891 parts In-Stock

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$10.500

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891

$10.500

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AZTECH Wire

Italy . 763 parts In-Stock

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$15.319

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$15.319

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Microchip USA

USA . 1,927 parts In-Stock

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Corphita

USA . 412 parts In-Stock

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Overview

Enhance your electronic designs with the SN75LV4737ADBRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Line Drivers & Receivers that are essential for reliable data transmission. This versatile product offers exceptional value and benefits to customers looking for high-performance components. With its small outline package and wide operating temperature range, the SN75LV4737ADBRE4 is perfect for various applications, making it a must-have for your projects. Upgrade your designs today with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and integration onto circuit boards, saving space and reducing overall assembly time.

Maximum Supply Voltage: 3.6 V

Operates efficiently within a common voltage range, ensuring compatibility with a variety of systems and applications.

No. of Functions: 3

Having multiple functions in a single device reduces the need for additional components, simplifying circuit design and reducing costs.

Maximum Transmit Delay: 850 ns

Fast transmission delay ensures quick and responsive signal transmission, critical for high-speed data communication.

Maximum High Level Input Current: 0.000001 Amp

Low input current requirement minimizes power consumption and heat generation, enhancing energy efficiency.

Output Characteristics: TOTEM-POLE

Totem-pole output configuration provides both high and low output states, enabling bidirectional communication for versatile signal processing.

Width: 5.3 mm

Compact width allows for efficient use of space on PCBs, especially in applications with limited board real estate.

Receiver No. of Bits: 5

Having a higher number of bits in the receiver enhances data resolution and accuracy, crucial for precise signal interpretation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, ensuring reliable performance in diverse environments.

Interface Standard: EIA-232-F; TIA-232-F; V.11

Compliance with multiple interface standards ensures seamless connectivity with various communication protocols and equipment, enhancing interoperability.

Maximum Supply Current: 20.7 mA

Low supply current minimizes power consumption, reducing operating costs and extending battery life in portable devices.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input ensures robust signal conditioning, improving noise immunity and signal integrity for reliable data transmission.

Technical Specifications

Line Drivers & Receivers SN75LV4737ADBRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.11

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10.5 V

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

2 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

200 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

850 ns

Width:

5.3 mm

Trade Compliance

SN75LV4737ADBRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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