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SN75LBC184DG4

Texas Instruments

SN75LBC184DG4 by Texas Instruments

SN75LBC184DG4 by Texas Instruments is a line driver and receiver with a max supply voltage of 5.25V. It has a max transmit delay of 1300ns and is commonly used in EIA-485, TIA-485, and ISO 8482 interface applications.

Median Price

$2.380

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22 parts In-Stock

1+ parts

-

100+ parts

$2.380

1k+ parts

$2.130

10k+ parts

$2.010

22

-

$2.380

$2.130

$2.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.510

100+ parts

-

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-

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300

$2.510

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Mobius Materials

USA . 45 parts In-Stock

1+ parts

$9.170

100+ parts

$7.330

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-

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45

$9.170

$7.330

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Chip Stock

USA . 8,340 parts In-Stock

1+ parts

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8,340

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Vyrian

USA . 7,097 parts In-Stock

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7,097

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Digiode

USA . 299 parts In-Stock

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299

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 22 parts In-Stock

1+ parts

$1.900

100+ parts

$1.852

1k+ parts

$1.843

10k+ parts

-

22

$1.900

$1.852

$1.843

-

Parana Technologies

USA . 2,376 parts In-Stock

1+ parts

$2.293

100+ parts

-

1k+ parts

$2.793

10k+ parts

-

2,376

$2.293

-

$2.793

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Continental Prestige Electronics

USA . 4,160 parts In-Stock

1+ parts

$2.510

100+ parts

-

1k+ parts

-

10k+ parts

$2.460

4,160

$2.510

-

-

$2.460

Argo Parts USA

USA . 2,473 parts In-Stock

1+ parts

$2.510

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-

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2,473

$2.510

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.510

100+ parts

-

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100

$2.510

-

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DigiPath Technology Company

USA . 1,816 parts In-Stock

1+ parts

$2.524

100+ parts

-

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10k+ parts

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1,816

$2.524

-

-

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ChromeModa Solutions

Germany . 5,713 parts In-Stock

1+ parts

$2.576

100+ parts

$2.112

1k+ parts

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10k+ parts

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5,713

$2.576

$2.112

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IDEA Electronic Components Group

UK . 301 parts In-Stock

1+ parts

$2.576

100+ parts

-

1k+ parts

$2.318

10k+ parts

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301

$2.576

-

$2.318

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Corohmni

South Africa . 118 parts In-Stock

1+ parts

$5.826

100+ parts

-

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118

$5.826

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Ampacity Inc.

Singapore . 1,315 parts In-Stock

1+ parts

$10.500

100+ parts

-

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1,315

$10.500

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AZTECH Wire

Italy . 719 parts In-Stock

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$11.818

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719

$11.818

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One Stop Electronics

USA . 1,336 parts In-Stock

1+ parts

$24.500

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1,336

$24.500

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Corphita

USA . 237 parts In-Stock

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237

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Perfect Parts

USA . 196 parts In-Stock

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196

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Overview

Experience high-quality performance and reliability with the SN75LBC184DG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional products that meet the highest standards. The SN75LBC184DG4 is a versatile line driver and receiver, perfect for a wide range of applications. With its compact design and advanced technology, this product offers unmatched value and benefits to our customers. From its efficient power supplies to its differential output and low current consumption, the SN75LBC184DG4 provides superior performance and flexibility. Trust Texas Instruments for all your line driver and receiver needs, and experience the advantages of cutting-edge technology in your projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and ensures the product's long-term performance.

Surface Mount:

YES. The surface mount feature makes it easy to integrate into electronic circuits and enhances practicality.

Maximum Supply Voltage:

5.25 V. This higher supply voltage allows for improved signal transmission and overall performance.

No. of Functions:

1. The single function simplifies the application and operation of the product.

Package Shape:

RECTANGULAR. The rectangular package shape allows for efficient space utilization and easy assembly on circuit boards.

Maximum Transmit Delay:

1300 ns. This low transmit delay ensures quick and reliable data transmission.

Maximum Supply Voltage-1:

5.25 V. The higher supply voltage ensures stable power delivery for the product's optimal performance.

Power Supplies (V):

5. The 5V power supply makes it compatible with standard electronic systems and simplifies integration.

No. of Terminals:

8. The 8 terminals provide multiple connection options and versatility in different circuit setups.

Package Style (Meter):

SMALL OUTLINE. The small outline package style facilitates space-saving designs and allows for compact devices.

Minimum Supply Voltage-1:

4.75 V. The minimum supply voltage ensures compatibility with lower voltage systems and extends usability.

Maximum High Level Input Current:

0.0001 Amp. The low high-level input current requirement minimizes power consumption in the system.

Minimum Supply Voltage:

4.75 V. This minimum supply voltage guarantees the product's compatibility with various power sources.

Maximum Operating Temperature:

70 °C. The high maximum operating temperature allows for reliable operation in demanding environments.

Minimum Operating Temperature:

0 °C. The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD. This terminal finish enhances connection reliability, minimizing signal loss and corrosion.

Terminal Position:

DUAL. The dual terminal position enables versatile connection configurations for different applications.

Maximum Seated Height:

1.75 mm. The low maximum seated height ensures compatibility with slim and compact electronic designs.

Width:

3.9 mm. The narrow width improves flexibility and space efficiency in circuit board layouts.

Maximum Output Low Current:

0.1 Amp. The high maximum output low current allows for driving devices with higher current requirements.

Output Polarity:

COMPLEMENTARY. The complementary output polarity simplifies signal processing and enhances compatibility.

Receiver No. of Bits:

1. The single-bit receiver allows for simple data reception and processing.

Differential Output:

YES. The differential output improves noise immunity and enhances signal integrity over long distances.

Maximum Time At Peak Reflow Temperature (s):

30. The short reflow time reduces the risk of damage during soldering processes.

Peak Reflow Temperature °C:

260. The high peak reflow temperature ensures optimal solder joint reliability during assembly.

Length:

4.9 mm. The compact length allows for efficient utilization of space in electronic designs.

Minimum Out Swing:

1.5 V. The low minimum out swing ensures compatibility with various output devices and reduces the need for additional components.

Temperature Grade:

COMMERCIAL. This temperature grade ensures reliable operation within standard commercial environments.

Maximum Receive Delay:

300 ns. The low receive delay allows for fast data reception and processing.

Technology:

BIPOLAR. The bipolar technology provides robust signal amplification and transmission capabilities.

Terminal Form:

GULL WING. The gull wing terminal form simplifies assembly and ensures secure connections on circuit boards.

Interface Standard:

EIA-485; TIA-485; ISO 8482. This interface standard compatibility allows for seamless integration into various communication systems.

Maximum Supply Current:

25 mA. The maximum supply current requirement is low, minimizing power consumption and reducing system costs.

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER. The differential Schmitt trigger input characteristics enhance noise immunity and improve signal reliability.

Nominal Supply Voltage:

5 V. The nominal supply voltage ensures compatibility with typical electronic systems and simplifies design integration.

Terminal Pitch:

1.27 mm. The narrow terminal pitch provides high-density connections and enables compact PCB layout designs.

Nominal Supply Voltage-1:

5 V. This nominal supply voltage ensures consistent power delivery for efficient device operation.

Driver No. of Bits:

1. The single-bit driver simplifies data transmission and facilitates easy communication protocols.

Moisture Sensitivity Level (MSL):

1. The MSL 1 ensures robustness against moisture during storage and assembly processes.

Interface IC Type:

LINE TRANSCEIVER. This line transceiver interface IC type ensures seamless communication between different systems and devices.

Technical Specifications

Line Drivers & Receivers SN75LBC184DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485; TIA-485; ISO 8482

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

.1 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

300 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

1300 ns

Width:

3.9 mm

Trade Compliance

SN75LBC184DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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