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SN75LBC179P

Texas Instruments

SN75LBC179P by Texas Instruments

SN75LBC179P by Texas Instruments is a Line Driver & Receiver with 5V supply voltage, 18ns transmit delay, and totem-pole output. Ideal for EIA-485 and ISO 8482 interfaces in commercial-grade applications requiring differential Schmitt trigger inputs.

Median Price

$3.812

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 53 parts In-Stock

1+ parts

$7.600

100+ parts

$4.570

1k+ parts

$3.330

10k+ parts

-

53

$7.600

$4.570

$3.330

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Verical

USA . 254 parts In-Stock

1+ parts

-

100+ parts

$3.813

1k+ parts

$3.237

10k+ parts

$3.050

254

-

$3.813

$3.237

$3.050

DigiKey

USA . 154 parts In-Stock

1+ parts

-

100+ parts

$3.810

1k+ parts

-

10k+ parts

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154

-

$3.810

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Rochester

USA . 31 parts In-Stock

1+ parts

-

100+ parts

$2.900

1k+ parts

$2.590

10k+ parts

$2.440

31

-

$2.900

$2.590

$2.440

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 956 parts In-Stock

1+ parts

$2.422

100+ parts

-

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956

$2.422

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Vyrian

USA . 2,128 parts In-Stock

1+ parts

-

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2,128

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Sea View Technologies

USA . 45 parts In-Stock

1+ parts

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45

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Bristol Electronics

USA . 45 parts In-Stock

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45

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 158 parts In-Stock

1+ parts

$1.940

100+ parts

-

1k+ parts

$2.475

10k+ parts

-

158

$1.940

-

$2.475

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DigiPath Technology Company

USA . 1,715 parts In-Stock

1+ parts

$2.136

100+ parts

-

1k+ parts

-

10k+ parts

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1,715

$2.136

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IDEA Electronic Components Group

UK . 1,085 parts In-Stock

1+ parts

$2.180

100+ parts

-

1k+ parts

$1.962

10k+ parts

-

1,085

$2.180

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$1.962

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ChromeModa Solutions

Germany . 1,031 parts In-Stock

1+ parts

$2.180

100+ parts

$1.788

1k+ parts

-

10k+ parts

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1,031

$2.180

$1.788

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Corphita

USA . 1,194 parts In-Stock

1+ parts

$2.295

100+ parts

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1,194

$2.295

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Microchip USA

USA . 1,676 parts In-Stock

1+ parts

$24.375

100+ parts

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1,676

$24.375

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A-Z Elektronik GmbH

Germany . 6,995 parts In-Stock

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6,995

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Perfect Parts

USA . 515 parts In-Stock

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515

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Kepictronics

USA . 200 parts In-Stock

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200

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Overview

Enhance your communication systems with the SN75LBC179P by Texas Instruments. This top-of-the-line line driver/receiver offers unrivaled quality and reliability, thanks to the renowned manufacturer's commitment to excellence. Ideal for a wide range of applications, this product ensures seamless data transmission while maintaining high performance standards. Experience the value and benefits of advanced technology with this innovative solution that promises to elevate your networking capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 5.25 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic setups and configurations.

Maximum Transmit Delay: 18 ns

Provides fast and efficient signal transmission, reducing latency in data transfer.

Power Supplies (V): 5

Standard voltage requirement ensures compatibility with most power sources, making it easy to integrate into existing systems.

No. of Terminals: 8

Sufficient number of terminals for connecting multiple input and output devices, increasing the versatility of the product.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for easy installation in confined areas.

Maximum High Level Input Current: 0.0001 Amp

Low input current requirement helps in reducing power consumption and heat generation, making it energy-efficient.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures precise and accurate signal transmission, reducing the risk of data errors.

Differential Output: YES

Differential output helps in reducing noise and interference, resulting in a cleaner signal transmission.

Technical Specifications

Line Drivers & Receivers SN75LBC179P attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485; ISO 8482

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.81 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

.1 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

30 ns

Receiver No. of Bits:

1

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

18 ns

Width:

7.62 mm

Trade Compliance

SN75LBC179P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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