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SN75LBC176ADRG4

Texas Instruments

SN75LBC176ADRG4 by Texas Instruments

SN75LBC176ADRG4 by Texas Instruments is a Line Driver & Receiver with 5.25V max supply voltage, 12ns max transmit delay, and 8 terminals. Ideal for EIA-485-A, TIA-485-A, ISO 8482 interfaces in commercial temperature grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 23,100 parts In-Stock

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23,100

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Vyrian

USA . 3,336 parts In-Stock

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3,336

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Digiode

USA . 2,009 parts In-Stock

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2,009

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$4.783

100+ parts

$4.544

1k+ parts

$4.544

10k+ parts

-

700

$4.783

$4.544

$4.544

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Corohmni

South Africa . 85 parts In-Stock

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$9.814

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85

$9.814

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Parana Technologies

USA . 1,447 parts In-Stock

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$9.834

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$10.403

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1,447

$9.834

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$10.403

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DigiPath Technology Company

USA . 2,021 parts In-Stock

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$10.829

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$9.963

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2,021

$10.829

$9.963

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IDEA Electronic Components Group

UK . 1,014 parts In-Stock

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$11.050

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$10.498

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$9.945

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$11.050

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$9.945

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ChromeModa Solutions

Germany . 365 parts In-Stock

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$11.050

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$9.061

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365

$11.050

$9.061

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Semicontronic

India . 778 parts In-Stock

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$12.500

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$12.188

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$12.125

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778

$12.500

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AZTECH Wire

Italy . 872 parts In-Stock

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$17.388

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One Stop Electronics

USA . 1,118 parts In-Stock

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$21.500

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Ampacity Inc.

Singapore . 1,429 parts In-Stock

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$29.500

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Continental Prestige Electronics

USA . 6,901 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,668 parts In-Stock

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Argo Parts USA

USA . 3,538 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Microchip USA

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Corphita

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Overview

Enhance your industrial communication systems with the SN75LBC176ADRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. The SN75LBC176ADRG4 belongs to the Line Drivers & Receivers category, offering seamless integration and high performance. With its advanced technology and innovative design, this product provides exceptional value and benefits to customers. Upgrade your systems today and experience the advantages of the SN75LBC176ADRG4 for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and space-efficient integration into electronic circuits.

Maximum Supply Voltage: 5.25 V

Can handle higher supply voltages, increasing compatibility with different systems.

Package Shape: RECTANGULAR

The rectangular shape is standard and makes the product easy to handle and mount.

Maximum Transmit Delay: 12 ns

Low transmit delay ensures fast signal transmission, critical for real-time applications.

Power Supplies (V): 5

Operates at a standard voltage, making it compatible with a wide range of systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connection options and supports various communication protocols.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and reception.

Differential Output: YES

Differential output helps in noise reduction and signal integrity, especially in long-distance communication.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482

Compliance with industry standards ensures interoperability and compatibility with different equipment.

Technical Specifications

Line Drivers & Receivers SN75LBC176ADRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.1 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

20 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

12 ns

Width:

3.9 mm

Trade Compliance

SN75LBC176ADRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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