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SN75LBC175ADR

Texas Instruments

SN75LBC175ADR by Texas Instruments

SN75LBC175ADR by Texas Instruments is a 4-function line driver/receiver with 16 terminals, operating at 5V. It features a totem-pole output and differential Schmitt trigger input, suitable for EIA-422, TIA-422, EIA-485, TIA-485, ISO 8482 interfaces. With a max supply voltage of 5.25V and operating temperature range of 0-70°C, it's ideal for commercial applications requiring reliable signal transmission.

Median Price

$2.935

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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DigiKey

USA . 2,451 parts In-Stock

1+ parts

$3.530

100+ parts

$2.599

1k+ parts

$1.866

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-

2,451

$3.530

$2.599

$1.866

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Mouser Electronics

USA . 45 parts In-Stock

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$2.340

45

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$2.340

Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

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$2.361

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$2.361

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Ozdisan Elektronik

Türkiye . 1,923 parts In-Stock

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$2.465

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Vyrian

USA . 3,920 parts In-Stock

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Digiode

USA . 2,109 parts In-Stock

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NAC Semi

USA . 1,518 parts In-Stock

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$7.620

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$7.040

1,518

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$7.620

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$7.040

ComSIT Distribution GmbH

Germany . 702 parts In-Stock

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702

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ACDS - Activité Composants Distribution Service

France . 400 parts In-Stock

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Dan-Mar Components

USA . 400 parts In-Stock

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400

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Bristol Electronics

USA . 300 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 45 parts In-Stock

1+ parts

$1.990

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45

$1.990

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Aranea Global

USA . 50 parts In-Stock

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$2.313

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$2.221

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50

$2.313

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$2.221

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Component Stockers USA

USA . 288 parts In-Stock

1+ parts

$4.880

100+ parts

$3.590

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288

$4.880

$3.590

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Parana Technologies

USA . 1,751 parts In-Stock

1+ parts

$8.672

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$9.351

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1,751

$8.672

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$9.351

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ChromeModa Solutions

Germany . 6,580 parts In-Stock

1+ parts

$9.744

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$7.990

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6,580

$9.744

$7.990

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IDEA Electronic Components Group

UK . 1,387 parts In-Stock

1+ parts

$9.744

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$9.257

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$8.770

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1,387

$9.744

$9.257

$8.770

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AZTECH Wire

Italy . 411 parts In-Stock

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$12.940

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Microchip USA

USA . 350 parts In-Stock

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$16.340

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$16.240

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$16.190

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$16.140

350

$16.340

$16.240

$16.190

$16.140

Lixinc

USA . 13,671 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,625 parts In-Stock

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Perfect Parts

USA . 10,739 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,167 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

USA . 2,158 parts In-Stock

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GreenTree Electronics

Israel . 2,158 parts In-Stock

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DigiPath Technology Company

USA . 1,400 parts In-Stock

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$8.785

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Corphita

USA . 434 parts In-Stock

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Overview

Experience seamless data transmission and reliable communication with the SN75LBC175ADR Line Driver & Receiver by Texas Instruments. Designed with precision and quality in mind, this product boasts a small outline package style and a dual terminal position for easy installation. Perfect for applications requiring EIA-422, TIA-422, EIA-485, TIA-485, and ISO 8482 interface standards, the SN75LBC175ADR ensures high performance and efficiency. Trust in Texas Instruments to deliver top-notch technology that meets your needs. Upgrade your system today with the SN75LBC175ADR and experience unparalleled value and benefits like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the product.

Surface Mount: YES

Being surface mountable makes installation and integration of the product easy and efficient.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for increased flexibility and compatibility with various systems.

No. of Functions: 4

Having multiple functions in one product saves space and reduces the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to handle, making it suitable for a wide range of applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand higher temperatures and operate reliably in various environments.

Interface Standard: EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482

Compliance with multiple interface standards ensures compatibility with a wide range of communication systems.

Technology: BICMOS

The use of BICMOS technology combines the advantages of both bipolar and CMOS technologies, resulting in improved performance and efficiency.

Technical Specifications

Line Drivers & Receivers SN75LBC175ADR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

16 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN75LBC175ADR Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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