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SN75LBC175AD

Texas Instruments

SN75LBC175AD by Texas Instruments

SN75LBC175AD by Texas Instruments is a 16-terminal line driver with 4 functions, operating at 5V. It features EIA-422, TIA-422, EIA-485, TIA-485, and ISO 8482 interface standards. With a max supply voltage of 5.25V and output polarity as TRUE, it's ideal for commercial applications requiring differential Schmitt trigger input characteristics.

Median Price

$4.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 315 parts In-Stock

1+ parts

$1.930

100+ parts

$1.880

1k+ parts

-

10k+ parts

-

315

$1.930

$1.880

-

-

DigiKey

USA . 1,074 parts In-Stock

1+ parts

$4.080

100+ parts

$3.465

1k+ parts

$2.156

10k+ parts

-

1,074

$4.080

$3.465

$2.156

-

Mouser Electronics

USA . 264 parts In-Stock

1+ parts

$5.840

100+ parts

-

1k+ parts

$3.540

10k+ parts

$3.150

264

$5.840

-

$3.540

$3.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,295 parts In-Stock

1+ parts

$3.848

100+ parts

-

1k+ parts

-

10k+ parts

-

1,295

$3.848

-

-

-

Vyrian

USA . 2,341 parts In-Stock

1+ parts

$4.050

100+ parts

-

1k+ parts

-

10k+ parts

-

2,341

$4.050

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,746 parts In-Stock

1+ parts

$3.645

100+ parts

-

1k+ parts

-

10k+ parts

-

4,746

$3.645

-

-

-

Parana Technologies

USA . 839 parts In-Stock

1+ parts

$4.530

100+ parts

$420.688

1k+ parts

$4.077

10k+ parts

-

839

$4.530

$420.688

$4.077

-

DigiPath Technology Company

USA . 2,371 parts In-Stock

1+ parts

$4.988

100+ parts

-

1k+ parts

-

10k+ parts

-

2,371

$4.988

-

-

-

ChromeModa Solutions

Germany . 6,777 parts In-Stock

1+ parts

$5.090

100+ parts

$4.174

1k+ parts

-

10k+ parts

-

6,777

$5.090

$4.174

-

-

IDEA Electronic Components Group

UK . 928 parts In-Stock

1+ parts

$5.090

100+ parts

-

1k+ parts

$4.581

10k+ parts

-

928

$5.090

-

$4.581

-

Microchip USA

USA . 1,307 parts In-Stock

1+ parts

$25.600

100+ parts

$25.230

1k+ parts

$25.050

10k+ parts

$24.860

1,307

$25.600

$25.230

$25.050

$24.860

Kepictronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Elevate your electronic designs with the SN75LBC175AD by Texas Instruments, a top-of-the-line Line Driver & Receiver that offers unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this product guarantees superior performance and durability. Perfect for a wide range of applications, this versatile device provides customers with exceptional value and benefits. Upgrade your projects with the SN75LBC175AD and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and easy handling.

Surface Mount: YES

The surface mount capability makes installation easier and more efficient, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for reliable operation and compatibility with a wide range of systems.

No. of Functions: 4

Having multiple functions in a single device provides versatility and flexibility in designing and implementing various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into different circuit layouts and designs.

Maximum Supply Voltage-1: 5.25 V

Having a consistent maximum supply voltage ensures stable performance and prevents damage to the device.

Power Supplies (V): 5

The standard power supply voltage of 5V makes it compatible with many electronic systems and reduces the need for additional voltage conversion.

No. of Terminals: 16

Having a higher number of terminals provides more connection options, enabling greater flexibility in connecting the device to other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for more compact designs, ideal for applications with limited space.

Minimum Supply Voltage-1: 4.75 V

The minimum supply voltage ensures proper functionality at lower power levels, providing efficient energy usage.

Maximum High Level Input Current: 0.0001 Amp

The low maximum high level input current ensures minimal power consumption while maintaining reliable operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in various environmental conditions.

Output Characteristics: TOTEM-POLE

The totem-pole output characteristics provide strong signal integrity and drive capability, enhancing overall performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature ensures reliable operation even in low-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel, palladium, and gold provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved connectivity, reducing the risk of connection failure.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a compact design and easy integration into space-constrained applications.

Width: 3.9 mm

The narrow width enables efficient space utilization and allows for compact layouts, ideal for densely packed circuit boards.

Maximum Output Low Current: 8 Amp

The high maximum output low current capability ensures strong drive capability and reliable signal transmission.

Output Polarity: TRUE

The true output polarity ensures correct signal transmission and compatibility with other devices, reducing errors in data transmission.

Receiver No. of Bits: 4

The 4-bit receiver provides precision in data reception and transmission, making it suitable for applications that require accurate data transfer.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables the product to endure harsh soldering processes without degradation.

Length: 9.9 mm

The compact length allows for efficient space utilization and easy integration into various electronic systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial applications, ensuring reliability and performance.

Maximum Receive Delay: 16 ns

The low maximum receive delay ensures fast and efficient data transmission, making it ideal for applications that require real-time communication.

Technology: BICMOS

The use of BiCMOS technology combines the advantages of both bipolar and CMOS technology, offering high-speed performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical stability and easy soldering during assembly, ensuring reliable connections.

Interface Standard: EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482

The compatibility with multiple interface standards makes the product versatile and suitable for a wide range of communication protocols and systems.

Maximum Supply Current: 20 mA

The low maximum supply current ensures energy efficiency and prevents excessive power consumption, making it suitable for battery-powered applications.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input characteristics provide noise immunity and precise signal detection, ensuring reliable data transmission.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard electronic systems and reduces the need for additional voltage regulation.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy connection and compatibility with common connector sizes, simplifying the integration process.

Driver No. of Bits: 4

The 4-bit driver provides precision in signal amplification and transmission, ensuring accurate data transfer across the system.

Interface IC Type: LINE RECEIVER

The interface IC type of line receiver ensures proper signal reception and decoding, making it suitable for applications that require accurate data retrieval.

Technical Specifications

Line Drivers & Receivers SN75LBC175AD attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

16 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN75LBC175AD Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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