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SN75LBC173ADR

Texas Instruments

SN75LBC173ADR by Texas Instruments

SN75LBC173ADR by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 5V. It features EIA-422, TIA-422, EIA-485, TIA-485, ISO 8482 interface standards and BICMOS technology. Ideal for applications requiring differential Schmitt trigger input characteristics and true output polarity in commercial temperature grades.

Median Price

$2.682

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,500 parts In-Stock

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Vyrian

USA . 5,809 parts In-Stock

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Chip Stock

USA . 3,510 parts In-Stock

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Resion

USA . 970 parts In-Stock

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Digiode

USA . 502 parts In-Stock

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Nova Conductors

Japan . 83 parts In-Stock

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Inventory MP

USA . 48 parts In-Stock

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Bristol Electronics

USA . 18 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,453 parts In-Stock

1+ parts

$2.280

100+ parts

$2.223

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$2.212

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$2.280

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$2.212

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Ampacity Inc.

Singapore . 2,147 parts In-Stock

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$2.280

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Parana Technologies

USA . 764 parts In-Stock

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$5.892

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$6.676

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764

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ChromeModa Solutions

Germany . 4,760 parts In-Stock

1+ parts

$6.620

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$5.428

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IDEA Electronic Components Group

UK . 1,716 parts In-Stock

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Corohmni

South Africa . 171 parts In-Stock

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Microchip USA

USA . 2,488 parts In-Stock

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$16.180

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$15.950

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$15.840

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$15.720

2,488

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$15.950

$15.840

$15.720

AZTECH Wire

Italy . 275 parts In-Stock

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Perfect Parts

USA . 14,000 parts In-Stock

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Corphita

USA . 2,261 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,884 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Argo Parts USA

USA . 871 parts In-Stock

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Bastille Electronics

Australia . 870 parts In-Stock

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DigiPath Technology Company

USA . 564 parts In-Stock

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Overview

Elevate your communication network with the SN75LBC173ADR by Texas Instruments. Designed for reliability and precision, this line driver & receiver offers unmatched performance in various applications. With Texas Instruments' reputation for quality and innovation, you can trust that this product delivers exceptional value and benefits to customers. Improve signal transmission and streamline your system with the SN75LBC173ADR, setting new standards for efficiency and functionality in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, making this product suitable for high volume manufacturing.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can operate reliably in systems with varying voltage requirements.

No. of Functions: 4

The multiple functions offered by this product allow for versatile use in a variety of applications, increasing its value and utility.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of board space, making it easier to integrate this product into complex systems.

Power Supplies (V): 5

The availability of multiple power supplies ensures stable and consistent performance, making this product a reliable choice for critical applications.

No. of Terminals: 16

The high number of terminals provides flexibility for connecting to various components, enhancing the product's compatibility and functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for designs with limited area.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage allows for operation in systems with tight power constraints, increasing the product's versatility.

Maximum High Level Input Current: 0.0001 Amp

The low input current helps in reducing power consumption, making this product energy-efficient and cost-effective.

Technical Specifications

Line Drivers & Receivers SN75LBC173ADR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

16 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN75LBC173ADR Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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