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SN75HVD11P

Texas Instruments

SN75HVD11P by Texas Instruments

SN75HVD11P by Texas Instruments is an 8-terminal line driver with a max supply voltage of 3.6V and operating temperature range of 0-70°C. It features a differential output, EIA-485-A interface standard, and BICMOS technology, making it ideal for industrial applications requiring reliable data transmission over long distances.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,992 parts In-Stock

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Digiode

USA . 1,837 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 616 parts In-Stock

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$13.348

100+ parts

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$13.862

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616

$13.348

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$13.862

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AZTECH Wire

Italy . 796 parts In-Stock

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$14.628

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DigiPath Technology Company

USA . 1,899 parts In-Stock

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$14.698

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$13.522

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1,899

$14.698

$13.522

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ChromeModa Solutions

Germany . 4,891 parts In-Stock

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$14.998

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$12.298

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$14.998

$12.298

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IDEA Electronic Components Group

UK . 971 parts In-Stock

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$14.998

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$14.248

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$13.498

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971

$14.998

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$13.498

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One Stop Electronics

USA . 290 parts In-Stock

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$45.500

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$45.500

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A-Z Elektronik GmbH

Germany . 6,575 parts In-Stock

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Corphita

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Microchip USA

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Overview

Looking for a reliable and high-quality Line Driver & Receiver? Look no further than the SN75HVD11P by Texas Instruments. With a maximum supply voltage of 3.6V, this product offers fast transmit and receive delays, making it ideal for a wide range of applications. Whether you're working on industrial automation, automotive systems, or communication equipment, this compact and efficient device ensures smooth data transmission. Trust Texas Instruments for top-notch products that deliver value and performance for all your electronic needs. Upgrade to the SN75HVD11P today and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making the product suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while providing a stable performance.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy installation and integration into existing systems.

Maximum Transmit Delay: 40 ns

Fast transmit delay ensures efficient data transfer and low latency.

Power Supplies (V): 3.3

Utilizes common power supply voltage for easy compatibility with other components.

No. of Terminals: 8

Sufficient terminals for connecting multiple devices or systems.

Package Style (Meter): IN-LINE

In-line package style allows for space-saving and streamlined circuit design.

Maximum High Level Input Current: 0.0001 Amp

Low input current helps in minimizing power consumption and heat generation.

Minimum Supply Voltage: 3 V

Wide range of supply voltage tolerance for reliable operation.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures performance in various conditions.

Minimum Operating Temperature: 0 °C

Operates effectively even in low-temperature environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in wiring and installation.

Maximum Seated Height: 5.08 mm

Low profile design for compact installations.

Width: 7.62 mm

Narrow width for space-efficient circuit layout.

Maximum Output Low Current: 8 Amp

High output current capacity for driving loads or other components.

Differential Output: YES

Differential output improves noise immunity and signal integrity.

Length: 9.81 mm

Optimal length for versatile mounting options.

Minimum Out Swing: 1.5 V

Low out swing value ensures compatibility with various systems.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Maximum Receive Delay: 70 ns

Low receive delay for efficient data reception and processing.

Technology: BICMOS

Utilizes BiCMOS technology for a balance of speed and power efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals for secure and reliable connections.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482

Compliance with industry interface standards ensures compatibility with various devices.

Maximum Supply Current: 15.5 mA

Low supply current requirement for efficient power usage.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input for noise immunity and signal conditioning.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy PCB mounting and connection.

Interface IC Type: LINE TRANSCEIVER

Line transceiver IC type for reliable communication between systems.

Technical Specifications

Line Drivers & Receivers SN75HVD11P attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE 10 MBPS

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDIP-T8

Length:

9.81 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

70 ns

Receiver No. of Bits:

1

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

40 ns

Width:

7.62 mm

Trade Compliance

SN75HVD11P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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