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SN75HVD11DRG4

Texas Instruments

SN75HVD11DRG4 by Texas Instruments

SN75HVD11DRG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 40ns max transmit delay, and 70°C max operating temp. Ideal for EIA-485-A, TIA-485-A, ISO 8482 interfaces in commercial-grade applications requiring differential outputs and Schmitt trigger input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,556 parts In-Stock

1+ parts

-

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8,556

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Chip Stock

USA . 4,560 parts In-Stock

1+ parts

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4,560

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Digiode

USA . 4,313 parts In-Stock

1+ parts

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4,313

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,260 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

1,260

$0.500

$0.488

$0.485

-

Parana Technologies

USA . 809 parts In-Stock

1+ parts

$2.543

100+ parts

-

1k+ parts

$3.031

10k+ parts

-

809

$2.543

-

$3.031

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ChromeModa Solutions

Germany . 3,227 parts In-Stock

1+ parts

$2.857

100+ parts

$2.343

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-

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3,227

$2.857

$2.343

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IDEA Electronic Components Group

UK . 2,144 parts In-Stock

1+ parts

$2.857

100+ parts

-

1k+ parts

$2.571

10k+ parts

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2,144

$2.857

-

$2.571

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AZTECH Wire

Italy . 730 parts In-Stock

1+ parts

$5.357

100+ parts

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730

$5.357

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Corohmni

South Africa . 317 parts In-Stock

1+ parts

$11.931

100+ parts

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317

$11.931

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$13.821

100+ parts

$13.130

1k+ parts

$13.130

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350

$13.821

$13.130

$13.130

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Ampacity Inc.

Singapore . 685 parts In-Stock

1+ parts

$27.500

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685

$27.500

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One Stop Electronics

USA . 1,643 parts In-Stock

1+ parts

$38.500

100+ parts

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1,643

$38.500

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A-Z Elektronik GmbH

Germany . 4,975 parts In-Stock

1+ parts

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4,975

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Continental Prestige Electronics

USA . 2,307 parts In-Stock

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2,307

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Corphita

USA . 1,984 parts In-Stock

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1,984

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Argo Parts USA

USA . 1,775 parts In-Stock

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1,775

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DigiPath Technology Company

USA . 1,724 parts In-Stock

1+ parts

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100+ parts

$2.576

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1,724

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$2.576

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Microchip USA

USA . 175 parts In-Stock

1+ parts

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175

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Discover the power of reliable communication with the SN75HVD11DRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that ensure seamless data transmission. This versatile product is perfect for a wide range of applications, providing customers with a valuable solution for their connectivity needs. Experience the benefits of advanced technology, high performance, and exceptional value with the SN75HVD11DRG4. Trust Texas Instruments to deliver innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexible power supply options and compatibility with different systems.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient placement and mounting on circuit boards, optimizing space utilization.

Maximum Transmit Delay: 40 ns

The low maximum transmit delay ensures fast and responsive data transmission, critical for real-time applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide additional flexibility and control over the output signals, allowing for tri-state logic operation.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482

Compliance with multiple interface standards ensures interoperability and compatibility with a wide range of systems and devices.

Technical Specifications

Line Drivers & Receivers SN75HVD11DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE 10 MBPS

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

70 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

40 ns

Width:

3.9 mm

Trade Compliance

SN75HVD11DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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