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SN75HVD10DG4

Texas Instruments

SN75HVD10DG4 by Texas Instruments

SN75HVD10DG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 16ns max transmit delay, and 8 terminals. Ideal for EIA-485-A, TIA-485-A, ISO 8482 interfaces in commercial temperature grade applications requiring BICMOS technology.

Median Price

$3.010

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24 parts In-Stock

1+ parts

$3.010

100+ parts

$2.830

1k+ parts

$2.560

10k+ parts

-

24

$3.010

$2.830

$2.560

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,221 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

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3,221

$2.860

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-

-

Vyrian

USA . 4,976 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,976

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,682 parts In-Stock

1+ parts

$2.709

100+ parts

-

1k+ parts

-

10k+ parts

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3,682

$2.709

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-

-

Component Stockers USA

USA . 19 parts In-Stock

1+ parts

$3.060

100+ parts

-

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10k+ parts

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19

$3.060

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-

-

Parana Technologies

USA . 10 parts In-Stock

1+ parts

$5.291

100+ parts

-

1k+ parts

$5.919

10k+ parts

-

10

$5.291

-

$5.919

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ChromeModa Solutions

Germany . 6,216 parts In-Stock

1+ parts

$5.945

100+ parts

$4.875

1k+ parts

-

10k+ parts

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6,216

$5.945

$4.875

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IDEA Electronic Components Group

UK . 818 parts In-Stock

1+ parts

$5.945

100+ parts

-

1k+ parts

$5.350

10k+ parts

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818

$5.945

-

$5.350

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AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$9.700

100+ parts

-

1k+ parts

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10k+ parts

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639

$9.700

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A-Z Elektronik GmbH

Germany . 5,045 parts In-Stock

1+ parts

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5,045

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Microchip USA

USA . 322 parts In-Stock

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322

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DigiPath Technology Company

USA . 119 parts In-Stock

1+ parts

-

100+ parts

$5.360

1k+ parts

-

10k+ parts

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119

-

$5.360

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Overview

Enhance your communication systems with the Texas Instruments SN75HVD10DG4 Line Driver & Receiver. Manufactured by a trusted industry leader, this product promises reliability and superior performance. Ideal for applications requiring precise data transmission, this small outline package offers efficient signal processing with minimal delay. With a wide operating temperature range and low power consumption, customers can expect durable, cost-effective solutions for their networking needs. Upgrade to the SN75HVD10DG4 and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy PCB integration and helps in saving space, making it suitable for compact electronic designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in various system designs.

Maximum Transmit Delay: 16 ns

The low transmit delay ensures fast data transmission, making the product suitable for high-speed communication applications.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission, reducing the risk of errors in data communication.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures reliable operation in various electronic systems requiring consistent power supply.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482

Compliance with industry interface standards ensures interoperability with a wide range of devices, making it a versatile choice for communication networks.

Technical Specifications

Line Drivers & Receivers SN75HVD10DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE 32 MBPS

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

16 ns

Width:

3.9 mm

Trade Compliance

SN75HVD10DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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