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SN75HVD07DRG4

Texas Instruments

SN75HVD07DRG4 by Texas Instruments

SN75HVD07DRG4 by Texas Instruments is a Line Driver & Receiver with 5.5V max supply voltage, 400ns max transmit delay, and 70°C max operating temp. Ideal for EIA-485-A, TIA-485-A, ISO 8482E interfaces in commercial applications requiring differential output and Schmitt trigger input characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,672 parts In-Stock

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Digiode

USA . 3,709 parts In-Stock

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Vyrian

USA . 1,962 parts In-Stock

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Prism Electronics

USA . 8 parts In-Stock

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Parana Technologies

USA . 2,170 parts In-Stock

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$6.500

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$7.244

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$6.500

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IDEA Electronic Components Group

UK . 1,379 parts In-Stock

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$7.303

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$6.573

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ChromeModa Solutions

Germany . 207 parts In-Stock

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$7.303

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$5.988

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207

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$5.988

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AZTECH Wire

Italy . 692 parts In-Stock

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$15.340

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One Stop Electronics

USA . 821 parts In-Stock

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$20.500

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A-Z Elektronik GmbH

Germany . 5,738 parts In-Stock

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Corphita

USA . 4,197 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 408 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled performance and reliability with the SN75HVD07DRG4 by Texas Instruments, a leading manufacturer in the industry. This line driver/receiver offers seamless communication in various applications, ensuring optimal signal transmission and reception. With a robust design and cutting-edge technology, this product guarantees superior quality and efficiency. Upgrade your system today and experience the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and making installation straightforward.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, making it compatible with a wide range of systems.

Maximum Transmit Delay: 400 ns

Ensures fast and efficient transmission of data signals.

Power Supplies (V): 5

Operates efficiently with a standard supply voltage, making it widely compatible.

Package Style (Meter): SMALL OUTLINE

Compact design helps in saving space and allows for easy installation in various setups.

Output Characteristics: 3-STATE

Allows for high impedance state, enabling multiple drivers to share a common communication line.

Temperature Grade: COMMERCIAL

Suitable for use in commercial applications with standard temperature requirements.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482E

Complies with industry standards for communication interfaces, ensuring interoperability with other devices.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, providing high-performance and low power consumption.

Technical Specifications

Line Drivers & Receivers SN75HVD07DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE UPTO 1 MBPS

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

2.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

70 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

400 ns

Width:

3.9 mm

Trade Compliance

SN75HVD07DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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