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SN75C3232EDWG4

Texas Instruments

SN75C3232EDWG4 by Texas Instruments

SN75C3232EDWG4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It has a max transmit delay of 300ns and can handle up to 1.6A output low current. Ideal for EIA-232 interface applications requiring fast signal transmission in commercial temperature range.

Median Price

$2.650

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 211 parts In-Stock

1+ parts

-

100+ parts

$2.370

1k+ parts

$2.120

10k+ parts

$1.990

211

-

$2.370

$2.120

$1.990

DigiKey

USA . 211 parts In-Stock

1+ parts

-

100+ parts

$3.110

1k+ parts

-

10k+ parts

-

211

-

$3.110

-

-

Verical

USA . 211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.650

10k+ parts

$2.487

211

-

-

$2.650

$2.487

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,325 parts In-Stock

1+ parts

$1.700

100+ parts

-

1k+ parts

-

10k+ parts

-

1,325

$1.700

-

-

-

Vyrian

USA . 8,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,479

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,652 parts In-Stock

1+ parts

$1.611

100+ parts

-

1k+ parts

-

10k+ parts

-

1,652

$1.611

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$10.544

100+ parts

$9.595

1k+ parts

$8.646

10k+ parts

-

500

$10.544

$9.595

$8.646

-

Parana Technologies

USA . 2,263 parts In-Stock

1+ parts

$11.359

100+ parts

$1,054.862

1k+ parts

$10.223

10k+ parts

-

2,263

$11.359

$1,054.862

$10.223

-

DigiPath Technology Company

USA . 2,081 parts In-Stock

1+ parts

$12.508

100+ parts

$11.507

1k+ parts

-

10k+ parts

-

2,081

$12.508

$11.507

-

-

IDEA Electronic Components Group

UK . 1,743 parts In-Stock

1+ parts

$12.763

100+ parts

$12.125

1k+ parts

$11.487

10k+ parts

-

1,743

$12.763

$12.125

$11.487

-

ChromeModa Solutions

Germany . 861 parts In-Stock

1+ parts

$12.763

100+ parts

$10.466

1k+ parts

-

10k+ parts

-

861

$12.763

$10.466

-

-

Overview

Experience seamless and reliable communication with the SN75C3232EDWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that cater to a wide range of applications. With a focus on efficiency and performance, this product offers customers exceptional value and benefits. Whether you're looking to enhance your data transmission capabilities or improve signal integrity, the SN75C3232EDWG4 is the ideal solution for all your communication needs. Trust Texas Instruments to provide innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving in various applications.

Maximum Supply Voltage: 3.6 V

Can handle a maximum supply voltage of 3.6V, suitable for various voltage applications.

No. of Functions: 2

Having 2 functions in one package offers versatility and flexibility in design.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration and placement in circuit designs.

Maximum Transmit Delay: 300 ns

Low transmit delay ensures efficient and fast data transmission.

Power Supplies (V): 3.3/5

Supports multiple power supply options for compatibility with different systems.

No. of Terminals: 16

Having 16 terminals allows for connections to various components and peripherals.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is suitable for compact designs.

Maximum High Level Input Current: 0.000001 Amp

Low input current requirement helps in reducing power consumption and heat generation.

Minimum Supply Voltage: 3 V

Works efficiently at minimum supply voltage of 3V, making it suitable for low-power applications.

Maximum Operating Temperature: 70 °C

Can operate at a maximum temperature of 70°C, ensuring stable performance in various environments.

Minimum Operating Temperature: 0 °C

Can operate at a minimum temperature of 0°C, suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options and layout.

Maximum Seated Height: 2.65 mm

Low seated height makes it suitable for compact and slim designs.

Width: 7.5 mm

Compact width allows for easy placement on circuit boards with space constraints.

Maximum Output Low Current: 1.6 Amp

High output current capability ensures reliable performance for various load requirements.

Receiver No. of Bits: 2

2 bits receiver provides adequate data reception capability for basic communication needs.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds during assembly.

Peak Reflow Temperature °C: 260

Can handle high peak reflow temperature of 260°C during the soldering process.

Length: 10.3 mm

Compact length makes it suitable for various size constraints in electronic designs.

Minimum Out Swing: 10 V

Minimum output swing of 10V ensures reliable signal transmission with adequate amplitude.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures wide compatibility and suitability for commercial applications.

Maximum Receive Delay: 300 ns

Low receive delay ensures quick response and data reception.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections on circuit boards.

Interface Standard: EIA-232

Adhering to EIA-232 standard ensures compatibility and interoperability with other devices.

Maximum Supply Current: 1 mA

Low supply current requirement helps in reducing power consumption and heat generation.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide noise immunity and signal stability.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures stable operation in various applications.

Terminal Pitch: 1.27 mm

Compact terminal pitch allows for close positioning of terminals on the circuit board.

Driver No. of Bits: 2

2 bits driver provides adequate data transmission capability for basic communication needs.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type offers versatility in connecting and communicating with external systems.

Technical Specifications

Line Drivers & Receivers SN75C3232EDWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

300 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

300 ns

Width:

7.5 mm

Trade Compliance

SN75C3232EDWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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