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SN75C3232DRE4

Texas Instruments

SN75C3232DRE4 by Texas Instruments

SN75C3232DRE4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V power supplies. It features EIA-232 interface standard, Schmitt trigger input characteristics, and inverted output polarity. Ideal for applications requiring high-speed data transmission in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,735 parts In-Stock

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Digiode

USA . 3,913 parts In-Stock

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Nova Conductors

Japan . 76 parts In-Stock

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Parana Technologies

USA . 1,434 parts In-Stock

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$10.883

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-

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$11.358

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$10.883

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DigiPath Technology Company

USA . 2,374 parts In-Stock

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$11.983

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$11.983

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ChromeModa Solutions

Germany . 5,005 parts In-Stock

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$12.228

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$10.027

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$12.228

$10.027

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IDEA Electronic Components Group

UK . 1,587 parts In-Stock

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$12.228

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$11.617

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$11.005

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1,587

$12.228

$11.617

$11.005

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AZTECH Wire

Italy . 564 parts In-Stock

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$15.838

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Ampacity Inc.

Singapore . 547 parts In-Stock

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$43.500

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One Stop Electronics

USA . 522 parts In-Stock

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$44.500

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A-Z Elektronik GmbH

Germany . 6,917 parts In-Stock

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Argo Parts USA

USA . 3,045 parts In-Stock

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Continental Prestige Electronics

USA . 3,012 parts In-Stock

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Microchip USA

USA . 2,896 parts In-Stock

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Corphita

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iodParts Technologies Inc.

India . 471 parts In-Stock

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Perfect Parts

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Bastille Electronics

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Overview

Enhance your communication systems with the SN75C3232DRE4 by Texas Instruments, a high-quality line driver and receiver designed for optimal performance. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product offers reliable functionality and durability. Ideal for a wide range of applications, this device provides customers with seamless data transmission and reception. Upgrade your systems today with the SN75C3232DRE4 and experience the value, benefits, and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic material provides durability and epoxy offers protection against moisture and chemicals, making this product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, increasing its versatility.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional discrete components, simplifying the design and saving costs.

Package Shape: RECTANGULAR

Rectangular shape is common and easy to handle during assembly, ensuring compatibility with standard PCB layouts.

Maximum Supply Voltage-1: 3.6 V

Consistent with the maximum supply voltage, ensuring proper functionality and reliability.

Power Supplies (V): 3.3/5

Support for dual power supplies offers flexibility in system design, allowing compatibility with various voltage requirements.

No. of Terminals: 16

Sufficient number of terminals for connectivity and signal transmission needs, providing a solid foundation for communication.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space on PCB and allows for dense packing of components, ideal for miniaturized designs.

Minimum Supply Voltage-1: 3 V

Reliable operation even at lower supply voltages, ensuring compatibility with a wide range of power sources.

Maximum High Level Input Current: 0.000001 Amp

Low input current requirement minimizes power consumption, making this product energy-efficient and suitable for battery-powered applications.

Minimum Supply Voltage: 3 V

Working within a narrow range of supply voltages ensures stable and consistent performance under various operating conditions.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand elevated heat levels, making it suitable for industrial environments.

Minimum Operating Temperature: 0 °C

Operational reliability even in cold temperatures, ensuring consistent performance in diverse environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish enhances conductivity and corrosion resistance, ensuring reliable connections and longevity.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB mounting orientation, accommodating various assembly configurations and layouts.

Maximum Seated Height: 1.75 mm

Low-profile design with a small seated height saves space and allows for compact system integration, ideal for applications with height constraints.

Width: 3.9 mm

Slim width profile facilitates dense packing on PCBs, optimizing board space utilization and enabling high component count designs.

Maximum Output Low Current: 1.6 Amp

High output current capability supports robust signal transmission and driving capabilities, ensuring reliable operation in demanding applications.

Output Polarity: INVERTED

Inverted output polarity can be beneficial for specific applications requiring complementary signals or logic levels, enhancing versatility.

Receiver No. of Bits: 2

Having 2 bits in the receiver enhances data processing capabilities and accuracy, suitable for applications requiring higher resolution or complex signal decoding.

Technology: BIPOLAR

Bipolar technology offers fast switching speeds and high noise immunity, ensuring reliable signal integrity and performance in noisy environments.

Interface Standard: EIA-232

Compliance with industry-standard EIA-232 interface ensures interoperability and compatibility with a wide range of devices and systems.

Maximum Supply Current: 1 mA

Low supply current requirement minimizes power consumption, making this product energy-efficient and suitable for battery-operated applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable performance, suitable for a wide range of applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB layout and assembly, ensuring compatibility with commonly used manufacturing processes.

Driver No. of Bits: 2

Having 2 bits in the driver provides enhanced data transmission capabilities, suitable for applications requiring higher resolution or addressing.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver IC, this product offers bidirectional signal transmission capabilities, making it suitable for both transmitting and receiving data.

Technical Specifications

Line Drivers & Receivers SN75C3232DRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN75C3232DRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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