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SN75C3232D

Texas Instruments

SN75C3232D by Texas Instruments

SN75C3232D by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and inverted output polarity. Ideal for commercial temperature grade applications requiring bipolar technology and peak reflow at 260°C within a compact small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,435 parts In-Stock

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3,435

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Vyrian

USA . 3,425 parts In-Stock

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3,425

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Sunrise Surplus Inc.

USA . 40 parts In-Stock

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40

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Distributors (Availability)

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AZTECH Wire

Italy . 188 parts In-Stock

1+ parts

$9.351

100+ parts

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188

$9.351

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Parana Technologies

USA . 742 parts In-Stock

1+ parts

$13.078

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$13.575

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742

$13.078

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$13.575

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DigiPath Technology Company

USA . 479 parts In-Stock

1+ parts

$14.400

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$13.248

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479

$14.400

$13.248

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IDEA Electronic Components Group

UK . 2,016 parts In-Stock

1+ parts

$14.694

100+ parts

$13.959

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$13.225

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2,016

$14.694

$13.959

$13.225

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ChromeModa Solutions

Germany . 946 parts In-Stock

1+ parts

$14.694

100+ parts

$12.049

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946

$14.694

$12.049

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One Stop Electronics

USA . 713 parts In-Stock

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$49.500

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713

$49.500

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Corphita

USA . 1,952 parts In-Stock

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1,952

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Perfect Parts

USA . 1,086 parts In-Stock

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Kepictronics

USA . 900 parts In-Stock

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900

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Microchip USA

USA . 290 parts In-Stock

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290

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Overview

Upgrade your communication systems with the SN75C3232D by Texas Instruments. This high-quality line driver and receiver are designed for reliability and performance, making it ideal for a wide range of applications. With its compact design and advanced technology, this product offers customers unmatched value, benefits, and advantages. Trust Texas Instruments to deliver innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and makes the product lightweight, ideal for portable applications.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, increasing compatibility with different systems.

No. of Functions: 2

Offers multiple functions in a single device, reducing the need for additional components.

Maximum Supply Voltage-1: 3.6 V

Ensures consistent performance even at the maximum supply voltage.

Power Supplies (V): 3.3/5

Supports multiple power supply options, providing flexibility in system design.

No. of Terminals: 16

Provides ample connectivity options for various interfaces and connections.

Minimum Operating Temperature: 0 °C

Can operate reliably in low-temperature environments, suitable for a wide range of applications.

Maximum Output Low Current: 1.6 Amp

Capable of driving high-load devices, ensuring robust performance.

Receiver No. of Bits: 2

Provides accurate and reliable data reception for communication purposes.

Technology: BIPOLAR

Utilizes bipolar technology for fast and efficient signal processing.

Interface Standard: EIA-232

Complies with industry standards for interface communication, ensuring compatibility with a wide range of devices.

Technical Specifications

Line Drivers & Receivers SN75C3232D attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN75C3232D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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