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SN75C3222DBR

Texas Instruments

SN75C3222DBR by Texas Instruments

SN75C3222DBR by Texas Instruments is a Line Driver & Receiver with 20 terminals, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and dual-bit driver/receiver functions. Ideal for commercial applications requiring reliable data transmission in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,654 parts In-Stock

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Vyrian

USA . 3,315 parts In-Stock

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3,315

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Prism Electronics

USA . 11 parts In-Stock

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11

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Distributors (Availability)

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One Stop Electronics

USA . 679 parts In-Stock

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$0.500

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679

$0.500

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Parana Technologies

USA . 1,220 parts In-Stock

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$10.542

100+ parts

$978.989

1k+ parts

$9.488

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1,220

$10.542

$978.989

$9.488

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AZTECH Wire

Italy . 293 parts In-Stock

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$11.053

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293

$11.053

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DigiPath Technology Company

USA . 1,388 parts In-Stock

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$11.608

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$10.679

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1,388

$11.608

$10.679

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ChromeModa Solutions

Germany . 1,869 parts In-Stock

1+ parts

$11.845

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$9.713

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1,869

$11.845

$9.713

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IDEA Electronic Components Group

UK . 1,833 parts In-Stock

1+ parts

$11.845

100+ parts

$11.253

1k+ parts

$10.660

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1,833

$11.845

$11.253

$10.660

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A-Z Elektronik GmbH

Germany . 7,346 parts In-Stock

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7,346

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Corphita

USA . 2,933 parts In-Stock

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Microchip USA

USA . 255 parts In-Stock

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Perfect Parts

USA . 12 parts In-Stock

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Overview

Discover the superior quality and reliability of Texas Instruments with the SN75C3222DBR Line Drivers & Receivers. This innovative product offers seamless integration into various applications, providing customers with unmatched value and performance. With a compact design and advanced features, this line driver and receiver is the perfect choice for those seeking dependable solutions for their electronic needs. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of voltage inputs, making it versatile.

No. of Functions: 2

Offers multiple functions in a single component, saving space and cost.

Power Supplies (V): 3.3/5

Can operate on both 3.3V and 5V power supplies, providing flexibility.

Maximum Operating Temperature: 70 °C

Can operate efficiently in high-temperature environments.

Minimum Operating Temperature: 0 °C

Can function effectively in low-temperature conditions as well.

Maximum Output Low Current: 1.6 Amp

Provides high output current capability for driving loads.

Input Characteristics: SCHMITT TRIGGER

Improves noise immunity and signal integrity in noisy environments.

Interface Standard: EIA-232

Complies with industry standards for communication interfaces.

Technical Specifications

Line Drivers & Receivers SN75C3222DBR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH A 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN75C3222DBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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