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SN75C3221PWRG4

Texas Instruments

SN75C3221PWRG4 by Texas Instruments

SN75C3221PWRG4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and inverted output polarity. Ideal for commercial applications requiring a compact design and high-speed data transmission up to 10V swing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 23,618 parts In-Stock

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23,618

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Digiode

USA . 3,557 parts In-Stock

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3,557

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Vyrian

USA . 3,120 parts In-Stock

1+ parts

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3,120

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 761 parts In-Stock

1+ parts

$8.560

100+ parts

-

1k+ parts

$9.220

10k+ parts

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761

$8.560

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$9.220

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DigiPath Technology Company

USA . 802 parts In-Stock

1+ parts

$9.426

100+ parts

-

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802

$9.426

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ChromeModa Solutions

Germany . 5,499 parts In-Stock

1+ parts

$9.618

100+ parts

$7.887

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5,499

$9.618

$7.887

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IDEA Electronic Components Group

UK . 1,631 parts In-Stock

1+ parts

$9.618

100+ parts

$9.137

1k+ parts

$8.656

10k+ parts

-

1,631

$9.618

$9.137

$8.656

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AZTECH Wire

Italy . 463 parts In-Stock

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$11.204

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463

$11.204

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One Stop Electronics

USA . 446 parts In-Stock

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$37.500

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446

$37.500

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Ampacity Inc.

Singapore . 1,570 parts In-Stock

1+ parts

$45.500

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1,570

$45.500

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Component Stockers USA

USA . 474 parts In-Stock

1+ parts

$99.990

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474

$99.990

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Microchip USA

USA . 4,858 parts In-Stock

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4,858

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Corphita

USA . 4,231 parts In-Stock

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4,231

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Kepictronics

USA . 1,550 parts In-Stock

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1,550

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unleash the power of seamless communication with the SN75C3221PWRG4 by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This innovative Line Driver & Receiver is perfect for applications requiring precision and efficiency. Experience the value of smooth data transmission and enhanced performance with this cutting-edge product. Upgrade your electronics with the SN75C3221PWRG4 and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term usage.

Surface Mount: YES

This feature allows for easy integration onto PCBs, making installation and assembly of the product convenient.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can accommodate a wide range of power supply options.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard mounting configurations, simplifying installation.

Power Supplies (V): 3.3/5

This versatile power supply option allows for flexibility in different voltage requirements of various applications.

No. of Terminals: 16

The ample number of terminals provides connectivity options for diverse circuit configurations.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package design saves space and allows for denser PCB layouts, ideal for compact electronic devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement ensures efficient power consumption, lowering energy costs.

Maximum High Level Input Current: 0.000001 Amp

This extremely low input current minimizes power consumption and reduces heat generation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish enhances conductivity and ensures corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal positions offer redundancy and improve signal integrity, reducing the risk of signal loss.

Maximum Seated Height: 1.2 mm

The low seated height allows for a slim profile, suitable for applications with space constraints.

Width: 4.4 mm

The narrow width of the product enables compact PCB designs and integration into space-restricted environments.

Maximum Output Low Current: 0.001 Amp

This low output current capability ensures compatibility with sensitive components and reduces the risk of damage.

Output Polarity: INVERTED

The inverted output polarity allows for easy integration with various systems and offers compatibility with different signal types.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable solder joints during manufacturing processes.

Length: 5 mm

The compact length of the product allows for versatile mounting options and accommodates space-saving installations.

Minimum Out Swing: 10 V

The high minimum output swing capabilities provide a wide voltage range for signal transmission, ensuring signal integrity.

Temperature Grade: COMMERCIAL

This commercial temperature grade ensures reliable operation within standard temperature ranges, suitable for most commercial applications.

Maximum Receive Delay: 0 ns

This zero receive delay feature ensures real-time signal processing, vital for time-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and offers secure mechanical connections.

Interface Standard: EIA-232

The EIA-232 interface standard ensures compatibility with a wide range of devices, facilitating seamless communication.

Maximum Supply Current: 1 mA

With a low maximum supply current, this product is energy-efficient and minimizes power consumption.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics provide noise immunity and ensure reliable signal detection even in noisy environments.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V offers stable power delivery for consistent performance in various applications.

Terminal Pitch: 0.65 mm

The tight terminal pitch allows for high-density terminal configurations, optimizing space utilization on PCBs.

Nominal Supply Voltage-1: 3.3 V

The consistent nominal supply voltage ensures stable operation and compatibility with standard power supplies.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type enables bidirectional communication between different systems, enhancing connectivity options.

Technical Specifications

Line Drivers & Receivers SN75C3221PWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH A 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

1

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

.001 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN75C3221PWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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