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SN75C1168NE4

Texas Instruments

SN75C1168NE4 by Texas Instruments

SN75C1168NE4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 5V. It features a max transmit delay of 12ns and differential output interface for EIA-422-B, TIA-422-B, V.11 standards. Ideal for applications requiring high-speed data transmission in commercial temperature environments.

Median Price

$7.760

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 80 parts In-Stock

1+ parts

$7.760

100+ parts

$4.660

1k+ parts

$2.900

10k+ parts

-

80

$7.760

$4.660

$2.900

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,791 parts In-Stock

1+ parts

$3.866

100+ parts

-

1k+ parts

-

10k+ parts

-

4,791

$3.866

-

-

-

Vyrian

USA . 7,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,668

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,681 parts In-Stock

1+ parts

$3.663

100+ parts

-

1k+ parts

-

10k+ parts

-

1,681

$3.663

-

-

-

Parana Technologies

USA . 298 parts In-Stock

1+ parts

$5.027

100+ parts

-

1k+ parts

$5.581

10k+ parts

-

298

$5.027

-

$5.581

-

ChromeModa Solutions

Germany . 4,944 parts In-Stock

1+ parts

$5.648

100+ parts

$4.631

1k+ parts

-

10k+ parts

-

4,944

$5.648

$4.631

-

-

IDEA Electronic Components Group

UK . 1,768 parts In-Stock

1+ parts

$5.648

100+ parts

-

1k+ parts

$5.083

10k+ parts

-

1,768

$5.648

-

$5.083

-

Microchip USA

USA . 1,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

-

-

-

-

DigiPath Technology Company

USA . 596 parts In-Stock

1+ parts

-

100+ parts

$5.092

1k+ parts

-

10k+ parts

-

596

-

$5.092

-

-

Overview

Discover the cutting-edge SN75C1168NE4 from Texas Instruments, a top-of-the-line line driver & receiver that offers unparalleled performance and reliability. With a sleek rectangular package body and advanced BICMOS technology, this versatile component is perfect for applications requiring high-speed data transmission. Whether you're in the telecommunications, industrial automation, or automotive industry, this product delivers superior output characteristics and unmatched efficiency. Upgrade your system today with the SN75C1168NE4 and experience the quality and value that Texas Instruments is known for.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

Ensures compatibility with various systems and provides flexibility in power supply options.

Maximum Transmit Delay: 12 ns

Provides quick transmission of data signals, making the product suitable for high-speed applications.

Output Characteristics: 3-STATE

Allows for the output to be in high impedance state when not actively transmitting data, enhancing the efficiency of the system.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, resulting in low power consumption and high-speed operation.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Compliance with multiple interface standards ensures compatibility with a wide range of devices and systems.

Technical Specifications

Line Drivers & Receivers SN75C1168NE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

RECEIVER 3-STATE OUTPUTS

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

20 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

27 ns

Receiver No. of Bits:

2

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

12 ns

Width:

7.62 mm

Trade Compliance

SN75C1168NE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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