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SN75ALS176ADRG4

Texas Instruments

SN75ALS176ADRG4 by Texas Instruments

SN75ALS176ADRG4 by Texas Instruments is a Line Driver & Receiver with 5V supply, 11.5ns max transmit delay, and 18ns max receive delay. Ideal for EIA-422-B, TIA-422-B, EIA-485-A interfaces in commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,657 parts In-Stock

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Digiode

USA . 496 parts In-Stock

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Nova Conductors

Japan . 54 parts In-Stock

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One Stop Electronics

USA . 1,511 parts In-Stock

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$3.500

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Parana Technologies

USA . 438 parts In-Stock

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$13.257

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$13.764

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438

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ChromeModa Solutions

Germany . 4,982 parts In-Stock

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$14.896

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$12.215

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IDEA Electronic Components Group

UK . 433 parts In-Stock

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$14.896

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$14.151

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$13.406

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433

$14.896

$14.151

$13.406

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AZTECH Wire

Italy . 701 parts In-Stock

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$17.087

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701

$17.087

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Ampacity Inc.

Singapore . 317 parts In-Stock

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$44.500

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Corphita

USA . 2,844 parts In-Stock

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DigiPath Technology Company

USA . 2,036 parts In-Stock

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$13.430

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A-Z Elektronik GmbH

Germany . 1,727 parts In-Stock

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Microchip USA

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Aranea Global

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Overview

Enhance your communication systems with the SN75ALS176ADRG4 from Texas Instruments, a leading manufacturer known for delivering top-quality products. This Line Driver & Receiver offers reliable performance, low power consumption, and versatile applications in various industries. With its advanced technology and high-speed data transmission capabilities, this product provides exceptional value and efficiency to customers seeking seamless connectivity solutions. Upgrade your equipment today and experience the benefits of superior quality and performance with the SN75ALS176ADRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, perfect for various applications.

Surface Mount: YES

Allows for easy and secure mounting on printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs, providing flexibility in system design.

Maximum Transmit Delay: 11.5 ns

Low transmit delay ensures fast and reliable data transfer.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with a wide range of systems.

Output Characteristics: 3-STATE

Supports 3-state outputs for easy integration with multiple devices on the same bus.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with a temperature range of 0°C to 70°C.

Interface Standard: EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11; X.27

Complies with multiple interface standards, enhancing compatibility with different communication protocols.

Technical Specifications

Line Drivers & Receivers SN75ALS176ADRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

3-STATE DRIVER OUTPUT AND RECEIVER INPUT

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11; X.27

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

.02 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

18 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

11.5 ns

Width:

3.9 mm

Trade Compliance

SN75ALS176ADRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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