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SN75976A1DLG4

Texas Instruments

SN75976A1DLG4 by Texas Instruments

SN75976A1DLG4 by Texas Instruments is a Line Driver & Receiver with 9 functions, operating at 5V. It features a max transmit delay of 13.5ns and differential output for applications requiring high-speed data transmission in commercial-grade environments. The IC supports various interface standards like EIA-485 and SCSI-2, making it suitable for industrial communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,340 parts In-Stock

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3,340

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Digiode

USA . 452 parts In-Stock

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452

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Distributors (Availability)

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One Stop Electronics

USA . 1,559 parts In-Stock

1+ parts

$2.500

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1,559

$2.500

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Parana Technologies

USA . 258 parts In-Stock

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$5.930

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$6.715

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258

$5.930

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$6.715

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ChromeModa Solutions

Germany . 5,868 parts In-Stock

1+ parts

$6.663

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$5.464

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5,868

$6.663

$5.464

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IDEA Electronic Components Group

UK . 1,873 parts In-Stock

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$6.663

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$5.997

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1,873

$6.663

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$5.997

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AZTECH Wire

Italy . 482 parts In-Stock

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$7.969

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482

$7.969

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Component Stockers USA

USA . 561 parts In-Stock

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$99.990

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561

$99.990

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Corphita

USA . 4,411 parts In-Stock

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Microchip USA

USA . 2,545 parts In-Stock

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DigiPath Technology Company

USA . 865 parts In-Stock

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$6.007

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865

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Overview

Experience top-notch performance and reliability with the SN75976A1DLG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology in line drivers & receivers. This versatile product offers seamless integration and superior functionality, making it ideal for a wide range of applications. Trust in the quality and innovation that Texas Instruments brings to the table, and elevate your projects with the SN75976A1DLG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various electronic applications.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle higher power levels, providing reliable performance in different operating conditions.

Maximum Transmit Delay: 13.5 ns

The low transmit delay ensures quick signal transmission, making this product suitable for high-speed data communication applications.

Output Characteristics: 3-STATE

The 3-STATE output allows for tri-state control, enabling the driver to output a high impedance state when not actively driving a signal line, enhancing system flexibility and efficiency.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high-speed performance, low power consumption, and enhanced reliability in this product.

Interface Standard: X3.129; X3.131; X3.277; EIA-485; SCSI-2; ISO 8482; IPI

Compatibility with multiple interface standards makes this product versatile and ensures seamless integration into different communication systems.

Technical Specifications

Line Drivers & Receivers SN75976A1DLG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

COMMON I/O; ADDITIONAL COMMON ENABLE INPUT

Differential Output:

YES

Driver No. of Bits:

9

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

X3.129; X3.131; X3.277; EIA-485; SCSI-2; ISO 8482; IPI

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

9

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

.1 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

16.5 ns

Receiver No. of Bits:

9

Maximum Seated Height:

2.79 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

13.5 ns

Width:

7.5 mm

Trade Compliance

SN75976A1DLG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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