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SN74LV594ADRG4

Texas Instruments

SN74LV594ADRG4 by Texas Instruments

SN74LV594ADRG4 by Texas Instruments is an 8-bit digital shift register with a supply voltage of 2-5.5V and propagation delay of 18.6ns. It is used in automotive applications, featuring positive edge triggering and a max frequency of 50MHz at nominal supply. The package style is small outline, making it suitable for compact designs requiring high-speed data shifting capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,558 parts In-Stock

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Digiode

USA . 199 parts In-Stock

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199

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AZTECH Wire

Italy . 195 parts In-Stock

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$17.689

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$17.689

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Parana Technologies

USA . 1,219 parts In-Stock

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$19.697

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$19.686

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DigiPath Technology Company

USA . 1,523 parts In-Stock

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$21.689

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$19.954

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One Stop Electronics

USA . 1,410 parts In-Stock

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$22.000

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ChromeModa Solutions

Germany . 3,356 parts In-Stock

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$22.132

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$18.148

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IDEA Electronic Components Group

UK . 807 parts In-Stock

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$22.132

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$21.025

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$19.919

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807

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Component Stockers USA

USA . 703 parts In-Stock

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$99.990

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Corphita

USA . 3,790 parts In-Stock

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Microchip USA

USA . 1,173 parts In-Stock

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Overview

Unlock endless possibilities with the SN74LV594ADRG4 by Texas Instruments. Crafted with precision and expertise, this digital shift register is designed to revolutionize your projects. Perfect for automotive applications and beyond, this product boasts unparalleled reliability and performance. Experience seamless integration and unmatched efficiency with the SN74LV594ADRG4 - your key to success in the world of digital electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, ensuring a longer lifespan for the product.

No. of Bits: 8

Offers a sufficient number of bits for various digital signal processing applications.

Nominal Supply Voltage / Vsup (V): 2.5

Optimized supply voltage for efficient operation and power consumption.

Propagation Delay (tpd): 18.6 ns

Low propagation delay ensures fast and efficient data transfer within the shift registers.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, such as automotive applications, ensuring reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Digital Shift Registers SN74LV594ADRG4 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

PARALLEL OUTPUT IS REGISTERED

Count Direction:

RIGHT

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

50000000 Hz

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay (tpd):

18.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

115 MHz

Trade Compliance

SN74LV594ADRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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