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SN74LS325NP3

Texas Instruments

SN74LS325NP3 by Texas Instruments

SN74LS325NP3 by Texas Instruments is a TTL technology oscillator with 16 terminals and a 5V supply voltage. It operates b/w 0°C to 70°C, housed in a plastic/epoxy package for through-hole mounting. Ideal for applications requiring precise timing functions in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,896 parts In-Stock

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Digiode

USA . 2,731 parts In-Stock

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2,731

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Parana Technologies

USA . 1,403 parts In-Stock

1+ parts

$2.062

100+ parts

-

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$2.583

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1,403

$2.062

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$2.583

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DigiPath Technology Company

USA . 1,760 parts In-Stock

1+ parts

$2.271

100+ parts

$2.089

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1,760

$2.271

$2.089

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ChromeModa Solutions

Germany . 2,175 parts In-Stock

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$2.317

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$1.900

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2,175

$2.317

$1.900

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IDEA Electronic Components Group

UK . 244 parts In-Stock

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$2.317

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$2.085

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244

$2.317

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$2.085

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Ampacity Inc.

Singapore . 1,005 parts In-Stock

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$4.010

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1,005

$4.010

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Semicontronic

India . 778 parts In-Stock

1+ parts

$4.010

100+ parts

$3.910

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$3.890

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778

$4.010

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$3.890

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One Stop Electronics

USA . 300 parts In-Stock

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$4.010

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300

$4.010

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AZTECH Wire

Italy . 376 parts In-Stock

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$13.367

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Corphita

USA . 841 parts In-Stock

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Corohmni

South Africa . 122 parts In-Stock

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Overview

Unlock the power of precision with the SN74LS325NP3 by Texas Instruments. Crafted with the highest quality materials and cutting-edge technology, this versatile component is perfect for a wide range of applications in the electronics industry. From signal processing to frequency synthesis, this TTL oscillator offers reliable performance and unmatched durability. Trust Texas Instruments to deliver superior products that exceed expectations. Experience the difference with the SN74LS325NP3 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides a sturdy and durable package body, ensuring the longevity and reliability of the product.

Technology: TTL

TTL technology offers high speed and efficiency, making this oscillator a suitable choice for various applications requiring fast signal processing.

Nominal Supply Voltage: 5V

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems and easy to integrate.

Power Supplies (V): 5

Runs on a single 5V power supply, simplifying the power requirement for the oscillator and minimizing complexity in the setup.

No. of Terminals: 16

Comes with 16 terminals, providing flexibility in connecting to other components and devices, allowing for versatile usage scenarios.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this oscillator can withstand high temperatures, ensuring stable performance in various environments.

Minimum Operating Temperature: 0 °C

Designed to function reliably even at low temperatures down to 0°C, making it suitable for a wide range of operating conditions.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature allows for easy and secure installation onto circuit boards or other surfaces, making it convenient to deploy in different setups.

Technical Specifications

Other Function Oscillators SN74LS325NP3 attributes and parameters. Explore more Other Function Oscillators devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

DIP16,.3

Power Supplies (V):

5

Sub-Category:

Other Oscillators

Nominal Supply Voltage:

5 V

Technology:

TTL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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