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SN74LS221FN3

Texas Instruments

SN74LS221FN3 by Texas Instruments

SN74LS221FN3 by Texas Instruments is a TTL technology prescaler & multivibrator chip with 20 terminals. It operates at 5V, has a temperature range of 0-70°C, and comes in a square chip carrier package. Ideal for applications requiring precise frequency division and signal synchronization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,798 parts In-Stock

1+ parts

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7,798

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Digiode

USA . 1,947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,947

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 828 parts In-Stock

1+ parts

$17.369

100+ parts

-

1k+ parts

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10k+ parts

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828

$17.369

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One Stop Electronics

USA . 465 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

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465

$28.000

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Parana Technologies

USA . 440 parts In-Stock

1+ parts

$29.136

100+ parts

-

1k+ parts

$55.858

10k+ parts

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440

$29.136

-

$55.858

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DigiPath Technology Company

USA . 218 parts In-Stock

1+ parts

$32.082

100+ parts

$29.516

1k+ parts

-

10k+ parts

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218

$32.082

$29.516

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ChromeModa Solutions

Germany . 3,894 parts In-Stock

1+ parts

$32.737

100+ parts

$26.844

1k+ parts

-

10k+ parts

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3,894

$32.737

$26.844

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IDEA Electronic Components Group

UK . 1,917 parts In-Stock

1+ parts

$32.737

100+ parts

$31.100

1k+ parts

$29.463

10k+ parts

-

1,917

$32.737

$31.100

$29.463

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Corphita

USA . 4,730 parts In-Stock

1+ parts

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4,730

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Overview

Unlock the power of precision with the SN74LS221FN3 by Texas Instruments. Crafted with high-quality materials and cutting-edge technology, this prescaler & multivibrator chip offers unparalleled performance and reliability. Ideal for a wide range of applications, from telecommunications to industrial automation, this versatile component delivers exceptional value and benefits to customers seeking superior quality and efficiency. Trust Texas Instruments to provide innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it a good choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with a wide range of systems, making it a versatile and practical choice for different applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even under demanding conditions, making it suitable for various industrial applications.

Technology: TTL

The use of TTL technology provides high-speed operation and reliable performance, making it a suitable choice for applications that require precise timing and signal processing.

Technical Specifications

Prescaler & Multivibrators SN74LS221FN3 attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Sub-Category:

Prescaler/Multivibrators

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74LS221FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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