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SN65MLVD047PWG4

Texas Instruments

SN65MLVD047PWG4 by Texas Instruments

SN65MLVD047PWG4 by Texas Instruments is a 4-function line driver with a max supply voltage of 3.6V and true output polarity. It features a small outline package style, suitable for industrial applications requiring fast transmission speeds and low power consumption. With a differential output and EIA-899 interface standard, it ensures reliable data communication in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,669 parts In-Stock

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4,669

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Digiode

USA . 1,975 parts In-Stock

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1,975

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Distributors (Availability)

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Parana Technologies

USA . 2,010 parts In-Stock

1+ parts

$2.579

100+ parts

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$3.070

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2,010

$2.579

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$3.070

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DigiPath Technology Company

USA . 1,551 parts In-Stock

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$2.840

100+ parts

$2.613

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1,551

$2.840

$2.613

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ChromeModa Solutions

Germany . 3,774 parts In-Stock

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$2.898

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$2.376

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3,774

$2.898

$2.376

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IDEA Electronic Components Group

UK . 1,472 parts In-Stock

1+ parts

$2.898

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$2.608

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1,472

$2.898

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$2.608

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AZTECH Wire

Italy . 614 parts In-Stock

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$12.410

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614

$12.410

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One Stop Electronics

USA . 675 parts In-Stock

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$36.500

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675

$36.500

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Corphita

USA . 3,217 parts In-Stock

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Microchip USA

USA . 239 parts In-Stock

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239

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Speed Components Ltd (Excess)

Israel . 40 parts In-Stock

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Enhance your communication systems with the SN65MLVD047PWG4 by Texas Instruments, a top-of-the-line Line Driver & Receiver designed to deliver unparalleled performance and reliability. With a focus on quality and innovation, Texas Instruments has crafted a product that exceeds industry standards and provides seamless connectivity for a wide range of applications. From industrial automation to telecommunications, this versatile device offers customers the value, benefits, and advantages they need to stay ahead in today's fast-paced world. Trust Texas Instruments to deliver cutting-edge technology that meets your every requirement.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring reliable performance in various environmental conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of operating voltages, allowing for flexibility in different power supply configurations.

Maximum Transmit Delay: 2.4 ns

Enables fast and efficient signal transmission, reducing latency and improving overall system response time.

Output Polarity: TRUE

Ensures consistent and accurate signal transmission, preventing potential errors or misinterpretations in data communication.

Differential Output: YES

Provides noise immunity and signal integrity in differential signaling applications, enhancing overall data transmission reliability.

Temperature Grade: INDUSTRIAL

Designed to operate effectively in industrial temperature ranges, making it suitable for harsh and demanding environments.

Interface Standard: EIA-899; TIA-899

Complies with industry standards for communication interfaces, ensuring compatibility and interoperability with other devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, extending the lifespan and efficiency of the product.

Technical Specifications

Line Drivers & Receivers SN65MLVD047PWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.48 V

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.4 ns

Width:

4.4 mm

Trade Compliance

SN65MLVD047PWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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