Loading...

SN65LVDT33PWG4

Texas Instruments

SN65LVDT33PWG4 by Texas Instruments

SN65LVDT33PWG4 by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 3.3V. It features a totem-pole output and differential Schmitt trigger input characteristics. Ideal for EIA-644/TIA-644 interface standards in industrial temperature grades, offering fast response times of 6ns.

Median Price

$5.930

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 163 parts In-Stock

1+ parts

$5.930

100+ parts

$2.880

1k+ parts

$2.400

10k+ parts

$2.330

163

$5.930

$2.880

$2.400

$2.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,092 parts In-Stock

1+ parts

$4.028

100+ parts

-

1k+ parts

-

10k+ parts

-

1,092

$4.028

-

-

-

Component Electronics Inc.

Canada . 270 parts In-Stock

1+ parts

$4.620

100+ parts

$3.460

1k+ parts

$3.000

10k+ parts

-

270

$4.620

$3.460

$3.000

-

Vyrian

USA . 3,483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,483

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,079 parts In-Stock

1+ parts

$3.816

100+ parts

-

1k+ parts

-

10k+ parts

-

4,079

$3.816

-

-

-

Parana Technologies

USA . 1,203 parts In-Stock

1+ parts

$11.154

100+ parts

-

1k+ parts

$11.602

10k+ parts

-

1,203

$11.154

-

$11.602

-

DigiPath Technology Company

USA . 358 parts In-Stock

1+ parts

$12.282

100+ parts

-

1k+ parts

-

10k+ parts

-

358

$12.282

-

-

-

ChromeModa Solutions

Germany . 4,566 parts In-Stock

1+ parts

$12.533

100+ parts

$10.277

1k+ parts

-

10k+ parts

-

4,566

$12.533

$10.277

-

-

IDEA Electronic Components Group

UK . 104 parts In-Stock

1+ parts

$12.533

100+ parts

$11.906

1k+ parts

$11.280

10k+ parts

-

104

$12.533

$11.906

$11.280

-

Microchip USA

USA . 2,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,071

-

-

-

-

Overview

Unlock unparalleled performance and reliability with the SN65LVDT33PWG4 by Texas Instruments, a leading manufacturer in the industry. This line driver and receiver provides exceptional quality and superior functionality for a wide range of applications. Experience seamless communication and precision with this product, offering customers unmatched value and efficiency. Trust Texas Instruments to deliver innovative solutions that exceed expectations and enhance your projects. Elevate your designs with the SN65LVDT33PWG4 and discover the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers good durability and protection for the components inside, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards, saving space and simplifying the overall design.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the product can handle high voltage inputs, making it versatile for a variety of applications.

No. of Functions: 4

Having multiple functions in one product provides flexibility and efficiency in circuit design, reducing the need for additional components.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to work with, ensuring compatibility with standard assembly processes.

Power Supplies (V): 3.3

Operating at a power supply of 3.3V is common in many electronic systems, ensuring compatibility with existing setups.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options, enabling the product to interface with multiple devices or components.

Minimum Operating Temperature: -40 °C

The product can operate in extremely low temperatures, making it suitable for use in a wide range of environmental conditions.

Maximum Output Low Current: 4 Amp

Capable of delivering a high output current of 4A, the product can drive power-hungry components effectively.

Technology: BICMOS

Utilizing BiCMOS technology provides a good balance of speed and power efficiency, enhancing the overall performance of the product.

Technical Specifications

Line Drivers & Receivers SN65LVDT33PWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

4 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

23 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN65LVDT33PWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20