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SN65LVDT14PWRG4

Texas Instruments

SN65LVDT14PWRG4 by Texas Instruments

SN65LVDT14PWRG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 2.9ns max transmit delay, and 85°C max operating temp. Ideal for industrial applications requiring EIA-644-A interface standard and differential input characteristics in a compact package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,481 parts In-Stock

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Vyrian

USA . 3,068 parts In-Stock

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3,068

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,412 parts In-Stock

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$1.500

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-

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$1.500

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Parana Technologies

USA . 1,571 parts In-Stock

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$4.346

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$4.764

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$4.346

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$4.764

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DigiPath Technology Company

USA . 79 parts In-Stock

1+ parts

$4.785

100+ parts

$4.403

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79

$4.785

$4.403

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ChromeModa Solutions

Germany . 3,503 parts In-Stock

1+ parts

$4.883

100+ parts

$4.004

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$4.883

$4.004

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IDEA Electronic Components Group

UK . 230 parts In-Stock

1+ parts

$4.883

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$4.395

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230

$4.883

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$4.395

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Corohmni

South Africa . 112 parts In-Stock

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$5.942

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$5.942

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AZTECH Wire

Italy . 191 parts In-Stock

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$8.843

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One Stop Electronics

USA . 876 parts In-Stock

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$14.500

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Semicontronic

India . 1,149 parts In-Stock

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$17.500

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$17.062

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$16.975

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1,149

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$17.062

$16.975

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QUARKTWIN TECHNOLOGY LTD

USA . 27,207 parts In-Stock

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Continental Prestige Electronics

USA . 5,612 parts In-Stock

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Microchip USA

USA . 2,202 parts In-Stock

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Corphita

USA . 1,589 parts In-Stock

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Argo Parts USA

USA . 188 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock unparalleled performance and reliability with the SN65LVDT14PWRG4 by Texas Instruments, a leading manufacturer in the industry. Ideal for line drivers and receivers applications, this cutting-edge product delivers exceptional value and benefits to customers. Experience seamless communication and superior functionality without compromising on quality or efficiency. Trust Texas Instruments and elevate your projects to new heights with the SN65LVDT14PWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic package material is lightweight and durable, making the product easy to handle and resistant to damage during handling and transportation.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for versatile power supply options, making the product compatible with a wide range of systems.

Maximum Transmit Delay: 2.9 ns

Low transmit delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Power Supplies (V): 3.3

Standard power supply voltage ensures compatibility with industry-standard power sources, making integration into existing systems easier.

Maximum High Level Input Current: 0.00002 Amp

Low input current helps minimize power consumption and heat generation, improving overall efficiency and reliability of the product.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the product to be used in various environmental conditions, making it versatile and reliable.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission, reducing the risk of errors and improving overall system performance.

Differential Output: YES

Differential output helps reduce noise and improve signal quality, making the product suitable for high-fidelity audio and data transmission applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the product energy-efficient and suitable for high-performance applications.

Technical Specifications

Line Drivers & Receivers SN65LVDT14PWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644-A; TIA-644-A

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

3.8 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.9 ns

Width:

4.4 mm

Trade Compliance

SN65LVDT14PWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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