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SN65LVDT122DR

Texas Instruments

SN65LVDT122DR by Texas Instruments

SN65LVDT122DR by Texas Instruments is a Line Transceiver with 2 functions, operating at 3.3V nominal voltage. It offers differential output and Schmitt trigger input characteristics, suitable for industrial applications requiring fast signal transmission with max transmit/receive delay of 0.9ns in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,201 parts In-Stock

1+ parts

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6,201

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Digiode

USA . 3,954 parts In-Stock

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3,954

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 290 parts In-Stock

1+ parts

$6.194

100+ parts

-

1k+ parts

$6.958

10k+ parts

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290

$6.194

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$6.958

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DigiPath Technology Company

USA . 1,260 parts In-Stock

1+ parts

$6.821

100+ parts

$6.275

1k+ parts

-

10k+ parts

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1,260

$6.821

$6.275

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ChromeModa Solutions

Germany . 6,325 parts In-Stock

1+ parts

$6.960

100+ parts

$5.707

1k+ parts

-

10k+ parts

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6,325

$6.960

$5.707

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IDEA Electronic Components Group

UK . 1,613 parts In-Stock

1+ parts

$6.960

100+ parts

-

1k+ parts

$6.264

10k+ parts

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1,613

$6.960

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$6.264

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AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$14.639

100+ parts

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351

$14.639

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One Stop Electronics

USA . 1,147 parts In-Stock

1+ parts

$22.500

100+ parts

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1,147

$22.500

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Corphita

USA . 2,940 parts In-Stock

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2,940

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Microchip USA

USA . 437 parts In-Stock

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437

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Overview

Elevate your communication systems with the SN65LVDT122DR from Texas Instruments. This high-quality line driver and receiver offers top-of-the-line performance and reliability, making it a smart choice for a wide range of applications. With its advanced technology and durable construction, this product delivers exceptional value and benefits to customers seeking superior signal transmission. Trust Texas Instruments to provide you with the cutting-edge solutions you need to stay connected and efficient in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount capability makes it easy to integrate this product into compact electronic designs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product is suitable for a wide range of applications and can handle higher voltage levels without risk of damage.

No. of Functions: 2

Having multiple functions in one product offers versatility and convenience, allowing for multiple tasks to be performed efficiently with a single component.

Package Shape: RECTANGULAR

The rectangular package shape is a common and practical design that makes it easy to handle and install in various electronic systems.

Maximum Transmit Delay: 0.9 ns

The low maximum transmit delay ensures fast and efficient data transmission, making this product ideal for high-speed communication applications.

No. of Terminals: 16

The ample number of terminals allows for versatile connectivity options, enabling this product to be used in a variety of circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is ideal for applications where size constraints are a concern, without compromising on performance.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making this product versatile and easy to integrate into different systems.

Maximum Operating Temperature: 85°C

The high maximum operating temperature allows this product to withstand harsh environmental conditions and ensures reliable performance in various industrial settings.

Minimum Operating Temperature: -40°C

The low minimum operating temperature makes this product suitable for use in cold environments, ensuring consistent performance even in extreme conditions.

Terminal Position: DUAL

The dual terminal position provides flexibility in connecting external components and allows for easy integration into different circuit layouts.

Maximum Seated Height: 1.75 mm

The low maximum seated height ensures a slim profile for the product, making it suitable for applications where space constraints are a consideration.

Width: 3.9 mm

The compact width of the product allows for efficient use of space on a circuit board, enabling versatile placement and integration in electronic systems.

Receiver No. of Bits: 2

The 2-bit receiver allows for accurate and reliable data reception, ensuring data integrity and effective communication between devices.

Differential Output: YES

The differential output feature reduces noise and interference in signal transmission, enhancing signal quality and reliability in communication applications.

Length: 9.9 mm

The moderate length of the product offers a balance between compactness and ease of handling, making it suitable for various electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certifies this product for use in rugged industrial environments, ensuring durability and reliable performance in demanding conditions.

Maximum Receive Delay: 0.9 ns

The low maximum receive delay ensures minimal latency in data reception, making this product ideal for real-time communication applications that require fast response times.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, offering stability and durability in high-vibration environments or applications with frequent handling.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The use of a differential Schmitt trigger for input characteristics ensures accurate and reliable signal detection, improving noise immunity and signal integrity.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides stable power delivery to the product, ensuring consistent performance and preventing voltage fluctuations that could affect operation.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact and efficient layout on a circuit board, enabling high-density integration of this product in electronic systems.

Driver No. of Bits: 2

The 2-bit driver enables accurate and precise signal transmission, ensuring reliable data delivery and communication with external devices.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type offers compatibility with a wide range of communication protocols, making this product versatile and suitable for diverse applications.

Technical Specifications

Line Drivers & Receivers SN65LVDT122DR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Receive Delay:

.9 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

.9 ns

Width:

3.9 mm

Trade Compliance

SN65LVDT122DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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