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SN65LVDS389DBTG4

Texas Instruments

SN65LVDS389DBTG4 by Texas Instruments

SN65LVDS389DBTG4 by Texas Instruments is an 8-bit line driver with a max supply voltage of 3.6V, operating temperature range of -40 to 85°C, and interface standard EIA-644; TIA-644. It is used in industrial applications requiring true output polarity and differential outputs for high-speed data transmission.

Median Price

$6.970

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 137 parts In-Stock

1+ parts

$5.020

100+ parts

$3.170

1k+ parts

$2.420

10k+ parts

-

137

$5.020

$3.170

$2.420

-

Newark

USA . 137 parts In-Stock

1+ parts

$5.630

100+ parts

$4.010

1k+ parts

$3.260

10k+ parts

-

137

$5.630

$4.010

$3.260

-

Mouser Electronics

USA . 48 parts In-Stock

1+ parts

$8.310

100+ parts

$3.460

1k+ parts

-

10k+ parts

-

48

$8.310

$3.460

-

-

Element14

Singapore . 137 parts In-Stock

1+ parts

$8.980

100+ parts

$6.830

1k+ parts

$5.070

10k+ parts

$4.800

137

$8.980

$6.830

$5.070

$4.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 829 parts In-Stock

1+ parts

$6.982

100+ parts

-

1k+ parts

-

10k+ parts

-

829

$6.982

-

-

-

Vyrian

USA . 7,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,643

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,434 parts In-Stock

1+ parts

$6.615

100+ parts

-

1k+ parts

-

10k+ parts

-

2,434

$6.615

-

-

-

Parana Technologies

USA . 946 parts In-Stock

1+ parts

$7.239

100+ parts

-

1k+ parts

$7.742

10k+ parts

-

946

$7.239

-

$7.742

-

DigiPath Technology Company

USA . 695 parts In-Stock

1+ parts

$7.971

100+ parts

$7.334

1k+ parts

-

10k+ parts

-

695

$7.971

$7.334

-

-

ChromeModa Solutions

Germany . 6,569 parts In-Stock

1+ parts

$8.134

100+ parts

$6.670

1k+ parts

-

10k+ parts

-

6,569

$8.134

$6.670

-

-

IDEA Electronic Components Group

UK . 1,405 parts In-Stock

1+ parts

$8.134

100+ parts

-

1k+ parts

$7.321

10k+ parts

-

1,405

$8.134

-

$7.321

-

Microchip USA

USA . 3,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,356

-

-

-

-

Perfect Parts

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Overview

Experience unparalleled quality and reliability with the SN65LVDS389DBTG4 by Texas Instruments, a leading manufacturer in the industry. This line driver & receiver offers exceptional value, benefits, and advantages to customers across various applications. With its innovative technology and industrial-grade components, this product ensures seamless performance and efficiency. Trust Texas Instruments for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy assembly on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of systems and power sources.

No. of Functions: 8

Having 8 functions in one package increases the versatility and functionality of the product.

Maximum Transmit Delay: 2.9 ns

The low transmit delay ensures fast and responsive data transmission, suitable for high-speed applications.

Output Polarity: TRUE

Having true output polarity ensures accurate signal transmission without any inversion, improving data integrity.

Differential Output: YES

Differential outputs provide improved noise immunity and signal integrity, making the product suitable for high-noise environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Line Drivers & Receivers SN65LVDS389DBTG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

8

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

8

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.9 ns

Width:

4.4 mm

Trade Compliance

SN65LVDS389DBTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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