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SN65LVDS387DGGR

Texas Instruments

SN65LVDS387DGGR by Texas Instruments

SN65LVDS387DGGR by Texas Instruments is a CMOS line driver with 16 functions, operating at 3.3V. It features a max transmit delay of 2.9ns and differential output capability, suitable for EIA-644/TIA-644 interface standards in industrial applications requiring high-speed data transmission.

Median Price

$8.744

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,430 parts In-Stock

1+ parts

$8.744

100+ parts

$7.128

1k+ parts

$4.752

10k+ parts

-

25,430

$8.744

$7.128

$4.752

-

Mouser Electronics

USA . 2,329 parts In-Stock

1+ parts

$14.030

100+ parts

$9.000

1k+ parts

$7.470

10k+ parts

$7.470

2,329

$14.030

$9.000

$7.470

$7.470

Rochester

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$6.840

1k+ parts

$6.120

10k+ parts

$5.760

7

-

$6.840

$6.120

$5.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$4.752

100+ parts

-

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150

$4.752

-

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Digiode

USA . 1,083 parts In-Stock

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$6.270

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1,083

$6.270

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Vyrian

USA . 7,425 parts In-Stock

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7,425

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ComSIT Distribution GmbH

Germany . 1,403 parts In-Stock

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1,403

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Component Sense

UK . 802 parts In-Stock

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802

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Bristol Electronics

USA . 407 parts In-Stock

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407

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Sensible Micro Corp

USA . 193 parts In-Stock

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193

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Contempo Components LLC

USA . 23 parts In-Stock

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PC Components Company LLC

USA . 20 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 636 parts In-Stock

1+ parts

$4.595

100+ parts

-

1k+ parts

$5.058

10k+ parts

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636

$4.595

-

$5.058

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Netroflash

USA . 500 parts In-Stock

1+ parts

$4.752

100+ parts

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500

$4.752

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Continental Prestige Electronics

USA . 302 parts In-Stock

1+ parts

$4.752

100+ parts

-

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10k+ parts

$4.657

302

$4.752

-

-

$4.657

Advanced Electronics

New Zealand . 89 parts In-Stock

1+ parts

$4.847

100+ parts

$4.847

1k+ parts

$4.847

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89

$4.847

$4.847

$4.847

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DigiPath Technology Company

USA . 2,224 parts In-Stock

1+ parts

$5.060

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2,224

$5.060

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IDEA Electronic Components Group

UK . 1,038 parts In-Stock

1+ parts

$5.163

100+ parts

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$4.647

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1,038

$5.163

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$4.647

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ChromeModa Solutions

Germany . 216 parts In-Stock

1+ parts

$5.163

100+ parts

$4.234

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216

$5.163

$4.234

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Semicontronic

India . 9,052 parts In-Stock

1+ parts

$5.610

100+ parts

$5.470

1k+ parts

$5.442

10k+ parts

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9,052

$5.610

$5.470

$5.442

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Ampacity Inc.

Singapore . 8,900 parts In-Stock

1+ parts

$5.610

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8,900

$5.610

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Corphita

USA . 3,366 parts In-Stock

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$5.940

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$5.940

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Corohmni

South Africa . 311 parts In-Stock

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$8.031

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$8.031

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Argo Parts USA

USA . 194 parts In-Stock

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iodParts Technologies Inc.

India . 100 parts In-Stock

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100

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Overview

Unlock unparalleled performance and reliability with the SN65LVDS387DGGR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Line Drivers & Receivers that promise superior functionality and durability. Ideal for industrial applications, this product offers customers unmatched value, increased efficiency, and seamless integration. Experience the benefits of cutting-edge technology and elevate your projects to new heights with the SN65LVDS387DGGR. Elevate your expectations and trust in Texas Instruments for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the line driver & receiver.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and enhancing efficiency.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, ensuring compatibility with various systems.

No. of Functions: 16

Offers versatility and the ability to handle multiple functions within a single component.

Maximum Transmit Delay: 2.9 ns

Ensures fast and efficient data transmission, ideal for high-speed communication applications.

Power Supplies (V): 3.3

Optimal power supply voltage for reliable and stable operation of the line driver & receiver.

Width: 6.1 mm

Compact size allows for space-saving installation in tight layouts or crowded circuit boards.

Output Polarity: TRUE

Ensures accurate signal transmission without distortion, contributing to overall system performance.

Differential Output: YES

Provides superior noise immunity and signal integrity in communication systems.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing efficiency and reliability.

Technical Specifications

Line Drivers & Receivers SN65LVDS387DGGR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

16

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G64

JESD-609 Code:

e4

Length:

17 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

16

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.9 ns

Width:

6.1 mm

Trade Compliance

SN65LVDS387DGGR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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