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SN65LVDS2DRG4

Texas Instruments

SN65LVDS2DRG4 by Texas Instruments

SN65LVDS2DRG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 3.1ns max transmit delay, and 8mA max supply current. Ideal for EIA-644-A/TIA-644-A interface standard applications in industrial settings due to its TTL technology and differential Schmitt trigger input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,870 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,870

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Vyrian

USA . 2,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,554

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,053 parts In-Stock

1+ parts

$3.323

100+ parts

-

1k+ parts

$3.846

10k+ parts

-

2,053

$3.323

-

$3.846

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DigiPath Technology Company

USA . 1,037 parts In-Stock

1+ parts

$3.659

100+ parts

-

1k+ parts

-

10k+ parts

-

1,037

$3.659

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ChromeModa Solutions

Germany . 5,612 parts In-Stock

1+ parts

$3.734

100+ parts

$3.062

1k+ parts

-

10k+ parts

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5,612

$3.734

$3.062

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IDEA Electronic Components Group

UK . 972 parts In-Stock

1+ parts

$3.734

100+ parts

-

1k+ parts

$3.361

10k+ parts

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972

$3.734

-

$3.361

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AZTECH Wire

Italy . 489 parts In-Stock

1+ parts

$7.777

100+ parts

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1k+ parts

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10k+ parts

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489

$7.777

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One Stop Electronics

USA . 1,402 parts In-Stock

1+ parts

$28.500

100+ parts

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1k+ parts

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10k+ parts

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1,402

$28.500

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Corphita

USA . 2,466 parts In-Stock

1+ parts

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2,466

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Microchip USA

USA . 255 parts In-Stock

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255

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Overview

Experience seamless and reliable data transmission with the Texas Instruments SN65LVDS2DRG4 Line Driver & Receiver. Crafted with precision and quality by Texas Instruments, this product offers unmatched performance in a compact package, making it ideal for a wide range of applications. Whether you're looking to enhance communication systems or improve signal integrity in your designs, this versatile component delivers exceptional value and efficiency. Trust Texas Instruments for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Being surface mountable ensures easy and efficient installation on printed circuit boards, saving space and simplifying production processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of systems and power sources.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of board space and easy integration into existing designs.

Maximum Transmit Delay: 3.1 ns

The low transmit delay ensures fast and reliable data transmission, critical for high-speed communication systems.

Power Supplies (V): 3.3

The consistent power supply voltage of 3.3V ensures stable operation and compatibility with common voltage standards.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the device to other components and interfaces, enabling versatile integration in various systems.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures the device can operate even in lower power scenarios, increasing its versatility and applicability.

Maximum High Level Input Current: 0.00002 Amp

The low high-level input current helps in minimizing power consumption and increasing efficiency in the overall system.

Maximum Output Low Current: 8 Amp

The high output low current capability allows for driving demanding loads without external amplification, simplifying the circuit design.

Output Polarity: COMPLEMENTARY

The complementary output polarity simplifies signal processing and decoding, leading to more straightforward system design and integration.

Maximum Time At Peak Reflow Temperature (s): 30

The quick reflow time of 30 seconds at peak temperature ensures efficient manufacturing processes and reduces production time and costs.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range of -40 to 85°C ensures reliable operation in harsh environments and industrial applications.

Technology: TTL

The TTL technology ensures compatibility with a wide range of digital systems and devices, making it a versatile choice for various applications.

Interface Standard: EIA-644-A; TIA-644-A

Compliance with industry interface standards EIA-644-A and TIA-644-A ensures interoperability and compatibility with a wide range of communication systems.

Technical Specifications

Line Drivers & Receivers SN65LVDS2DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644-A; TIA-644-A

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

3.6 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

2.4 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3.1 ns

Width:

3.9 mm

Trade Compliance

SN65LVDS2DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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