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SN65LVDS22DG4

Texas Instruments

SN65LVDS22DG4 by Texas Instruments

SN65LVDS22DG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.6V max supply voltage. It offers differential output, EIA-644 interface standard, and is ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,417 parts In-Stock

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2,417

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Digiode

USA . 167 parts In-Stock

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167

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 694 parts In-Stock

1+ parts

$6.730

100+ parts

-

1k+ parts

$7.409

10k+ parts

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694

$6.730

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$7.409

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DigiPath Technology Company

USA . 1,525 parts In-Stock

1+ parts

$7.411

100+ parts

$6.818

1k+ parts

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1,525

$7.411

$6.818

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IDEA Electronic Components Group

UK . 1,734 parts In-Stock

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$7.562

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$6.806

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1,734

$7.562

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$6.806

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ChromeModa Solutions

Germany . 1,553 parts In-Stock

1+ parts

$7.562

100+ parts

$6.201

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1,553

$7.562

$6.201

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AZTECH Wire

Italy . 312 parts In-Stock

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$12.378

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312

$12.378

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One Stop Electronics

USA . 1,606 parts In-Stock

1+ parts

$25.500

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1,606

$25.500

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Corphita

USA . 4,041 parts In-Stock

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4,041

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Microchip USA

USA . 328 parts In-Stock

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328

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Overview

Unlock the power of high-performance data transmission with the SN65LVDS22DG4 by Texas Instruments. Crafted with precision and expertise, this line driver & receiver offers unparalleled reliability and efficiency for a wide range of applications. From industrial automation to automotive electronics, this cutting-edge product ensures seamless communication with its advanced features and top-notch quality. Experience the value and benefits of superior signal integrity, fast response times, and robust design that only Texas Instruments can deliver. Elevate your projects with the SN65LVDS22DG4 and take your performance to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 2

Multiple functions in a single package offer cost savings and efficiency in circuit design.

Maximum Transmit Delay: 6 ns

Low transmit delay ensures fast data transmission, suitable for high-speed applications.

Output Characteristics: DIFFERENTIAL

Differential outputs provide better noise immunity and signal integrity, ideal for long-distance communication.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in harsh environments.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold temperatures, making it suitable for industrial applications.

Interface Standard: EIA-644; TIA-644

Compliant with industry standards for easy integration and compatibility with other components.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures consistent performance of the device.

Technical Specifications

Line Drivers & Receivers SN65LVDS22DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

27 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

6 ns

Width:

3.9 mm

Trade Compliance

SN65LVDS22DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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