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SN65LVDS179DGK

Texas Instruments

SN65LVDS179DGK by Texas Instruments

SN65LVDS179DGK by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 2.7ns max transmit delay, and 3.3V power supplies. Ideal for EIA-644/TIA-644 interface standard applications requiring differential outputs in industrial temperature grades.

Median Price

$4.169

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 60,199 parts In-Stock

1+ parts

$3.664

100+ parts

$3.211

1k+ parts

$1.814

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60,199

$3.664

$3.211

$1.814

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Newark

USA . 273 parts In-Stock

1+ parts

$4.410

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$3.240

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$2.760

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273

$4.410

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$2.760

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Mouser Electronics

USA . 1,110 parts In-Stock

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$4.870

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$3.010

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$4.870

$3.010

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DigiKey

USA . 1,897 parts In-Stock

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$5.010

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$3.233

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$2.923

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$2.775

1,897

$5.010

$3.233

$2.923

$2.775

Element14

Singapore . 273 parts In-Stock

1+ parts

$5,430.000

100+ parts

$3,998.000

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$3,404.000

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273

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RS (Exports)

UK . 396 parts In-Stock

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$4.169

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$3.883

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Chip1Stop

Japan . 240 parts In-Stock

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Avnet

USA . 223 parts In-Stock

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$2.754

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$2.684

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Rochester

USA . 9 parts In-Stock

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$2.480

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$2.220

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$2.090

9

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$2.480

$2.220

$2.090

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$2.307

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$2.307

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Digiode

USA . 3,037 parts In-Stock

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$2.394

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3,037

$2.394

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TME

Poland . 31 parts In-Stock

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$4.690

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$3.780

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$3.780

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Chip Stock

USA . 21,899 parts In-Stock

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Vyrian

USA . 6,369 parts In-Stock

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6,369

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Bristol Electronics

USA . 479 parts In-Stock

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Semi Source

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First Choice Components Inc.

USA . 94 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 74 parts In-Stock

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Quantum Digital Technology

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Prism Electronics

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Sunrise Surplus Inc.

USA . 40 parts In-Stock

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Velocity Electronics

USA . 23 parts In-Stock

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Cogito LLC

Ukraine . 10 parts In-Stock

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EMSNET

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Semicontronic

India . 10,141 parts In-Stock

1+ parts

$2.140

100+ parts

$2.086

1k+ parts

$2.076

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$2.140

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$2.076

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Ampacity Inc.

Singapore . 9,888 parts In-Stock

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$2.140

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Corphita

USA . 4,056 parts In-Stock

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$2.268

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Continental Prestige Electronics

USA . 1,146 parts In-Stock

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$2.307

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$2.261

1,146

$2.307

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$2.261

Argo Parts USA

USA . 979 parts In-Stock

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$2.307

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$2.307

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Corohmni

South Africa . 247 parts In-Stock

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$2.999

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$2.999

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$3.089

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$2.935

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$2.935

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200

$3.089

$2.935

$2.935

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Parana Technologies

USA . 107 parts In-Stock

1+ parts

$10.673

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$991.139

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$9.606

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107

$10.673

$991.139

$9.606

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DigiPath Technology Company

USA . 1,048 parts In-Stock

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$11.752

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$10.812

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1,048

$11.752

$10.812

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ChromeModa Solutions

Germany . 3,444 parts In-Stock

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$11.992

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$9.833

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3,444

$11.992

$9.833

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IDEA Electronic Components Group

UK . 1,411 parts In-Stock

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$11.992

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$11.392

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$10.793

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$11.992

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$10.793

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Lixinc

USA . 6,200 parts In-Stock

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Perfect Parts

USA . 3,380 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 1,380 parts In-Stock

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1,380

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Cyclops Electronics Ltd (Excess)

UK . 74 parts In-Stock

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Glotronic Ltd.

UK . 59 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$2.261

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$2.192

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$2.146

50

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$2.261

$2.192

$2.146

Overview

Enhance your next project with the SN65LVDS179DGK by Texas Instruments, a high-quality line driver and receiver that offers exceptional performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will meet your needs seamlessly. Ideal for a wide range of applications, this device provides value through its efficient power usage, fast transmit delay, and differential output capability. Upgrade your system with the SN65LVDS179DGK and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power sources, making it versatile for different systems.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the circuit board for other components.

Maximum Transmit Delay: 2.7 ns

The low transmit delay ensures fast and efficient data transmission, crucial for high-speed communication systems.

Power Supplies (V): 3.3

The 3.3V power supply is a standard voltage level in many electronic devices, ensuring compatibility with a wide range of systems.

No. of Terminals: 8

With eight terminals, this product offers flexibility in connecting to other components or devices, enhancing its functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design with shrink pitch allow for high-density mounting on circuit boards, maximizing space efficiency.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement ensures compatibility with a variety of power sources, making it a versatile choice.

Maximum High Level Input Current: 0.00002 Amp

The low high level input current minimizes power consumption, making it energy-efficient for prolonged use.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40°C ensures operation in harsh environments, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Width: 3 mm

The compact 3mm width allows for easy integration into space-constrained designs, making it ideal for compact devices.

Maximum Output Low Current: 0.02 Amp

The maximum output low current capacity of 0.02 Amp ensures compatibility with a wide range of devices, suitable for various applications.

Differential Output: YES

The differential output feature provides superior noise immunity and signal integrity, ideal for high-quality communication systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly, optimizing product reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and reliable soldering during assembly, ensuring high-quality connections.

Length: 3 mm

The compact 3mm length saves space on the circuit board, ideal for designs with size constraints.

Minimum Out Swing: 0.247 V

The minimum output swing of 0.247 V ensures signal integrity and accuracy, crucial for reliable data transmission.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making it suitable for industrial applications.

Maximum Receive Delay: 4.5 ns

The low maximum receive delay of 4.5 ns ensures fast data reception, essential for real-time communication systems.

Technology: BIPOLAR

The bipolar technology offers high-speed performance and low power consumption, making it an efficient choice for data transmission.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy soldering during assembly, ensuring reliability in operation.

Interface Standard: EIA-644; TIA-644

Compliance with EIA-644 and TIA-644 interface standards ensures compatibility with industry-standard communication protocols, enhancing versatility.

Maximum Supply Current: 12 mA

The maximum supply current of 12 mA ensures low power consumption, ideal for energy-efficient designs.

Input Characteristics: DIFFERENTIAL

The differential input characteristics provide noise immunity and signal integrity, crucial for reliable data transmission in noisy environments.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a common standard in electronics, ensuring compatibility with many systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting, maximizing space efficiency on the circuit board.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type offers bidirectional communication capabilities, making it suitable for various applications.

Technical Specifications

Line Drivers & Receivers SN65LVDS179DGK attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Maximum Output Low Current:

.02 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.7 ns

Width:

3 mm

Trade Compliance

SN65LVDS179DGK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-610-9613, 5962016109613

NIIN

016109613

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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