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SN65LVDS179DG4

Texas Instruments

SN65LVDS179DG4 by Texas Instruments

SN65LVDS179DG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 2.7ns max transmit delay, and 85°C max operating temp. Ideal for EIA-644/TIA-644 interface applications requiring differential output and industrial temperature grade performance in a compact small outline package.

Median Price

$4.865

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 49 parts In-Stock

1+ parts

$4.860

100+ parts

$3.570

1k+ parts

$3.040

10k+ parts

$2.340

49

$4.860

$3.570

$3.040

$2.340

DigiKey

USA . 28 parts In-Stock

1+ parts

$4.870

100+ parts

-

1k+ parts

-

10k+ parts

-

28

$4.870

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,607 parts In-Stock

1+ parts

$4.617

100+ parts

-

1k+ parts

-

10k+ parts

-

4,607

$4.617

-

-

-

Chip Stock

USA . 22,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,040

-

-

-

-

Vyrian

USA . 8,509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,509

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,540 parts In-Stock

1+ parts

$4.374

100+ parts

-

1k+ parts

-

10k+ parts

-

3,540

$4.374

-

-

-

Parana Technologies

USA . 1,992 parts In-Stock

1+ parts

$6.051

100+ parts

-

1k+ parts

$6.829

10k+ parts

-

1,992

$6.051

-

$6.829

-

DigiPath Technology Company

USA . 2,057 parts In-Stock

1+ parts

$6.663

100+ parts

-

1k+ parts

-

10k+ parts

-

2,057

$6.663

-

-

-

ChromeModa Solutions

Germany . 3,904 parts In-Stock

1+ parts

$6.799

100+ parts

$5.575

1k+ parts

-

10k+ parts

-

3,904

$6.799

$5.575

-

-

IDEA Electronic Components Group

UK . 2,045 parts In-Stock

1+ parts

$6.799

100+ parts

-

1k+ parts

$6.119

10k+ parts

-

2,045

$6.799

-

$6.119

-

Microchip USA

USA . 2,689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,689

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-

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-

Overview

Unleash the power of the SN65LVDS179DG4 by Texas Instruments, a top-of-the-line Line Driver & Receiver designed to exceed your expectations. With Texas Instruments' renowned reputation for quality and innovation, this product delivers unparalleled performance and reliability. Ideal for a wide range of applications, this versatile device offers customers unmatched value, benefits, and advantages. Say hello to seamless communication and enhanced efficiency with the SN65LVDS179DG4 - the ultimate solution for your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components, making the product long-lasting and reliable.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance ensures compatibility with various power sources and helps prevent damage from voltage spikes.

Maximum Transmit Delay: 2.7 ns

The low transmit delay ensures fast and efficient data transmission, suitable for high-speed communication applications.

Power Supplies (V): 3.3

The 3.3V power supply ensures energy efficiency and compatibility with standard power sources, making the product cost-effective to operate.

Maximum High Level Input Current: 0.00002 Amp

The low input current requirement helps in reducing power consumption and heat generation, enhancing the overall efficiency of the product.

Output Characteristics: DIFFERENTIAL

The differential output allows for noise rejection and improved signal integrity, making the product suitable for applications requiring high precision and reliability.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the product suitable for use in harsh environmental conditions, ensuring consistent performance in extreme temperatures.

Interface Standard: EIA-644; TIA-644

Compliance with industry interface standards ensures compatibility and interoperability with a wide range of devices and systems, making the product versatile and easy to integrate.

Technical Specifications

Line Drivers & Receivers SN65LVDS179DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

.02 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.7 ns

Width:

3.9 mm

Trade Compliance

SN65LVDS179DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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