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SN65LVDS100DGKG4

Texas Instruments

SN65LVDS100DGKG4 by Texas Instruments

SN65LVDS100DGKG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 0.8ns max transmit delay, and 3.3V power supplies. Ideal for industrial applications requiring differential output and EIA-644-A interface standard compliance in a compact package style.

Median Price

$4.110

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$4.110

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Vyrian

USA . 4,472 parts In-Stock

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Digiode

USA . 238 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,517 parts In-Stock

1+ parts

$4.110

100+ parts

-

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$4.028

4,517

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$4.028

Argo Parts USA

USA . 3,679 parts In-Stock

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$4.110

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3,679

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Netroflash

USA . 50 parts In-Stock

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$4.110

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50

$4.110

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AZTECH Wire

Italy . 654 parts In-Stock

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$5.106

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654

$5.106

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Parana Technologies

USA . 796 parts In-Stock

1+ parts

$7.587

100+ parts

$704.591

1k+ parts

$6.829

10k+ parts

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796

$7.587

$704.591

$6.829

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DigiPath Technology Company

USA . 1,869 parts In-Stock

1+ parts

$8.354

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$8.354

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ChromeModa Solutions

Germany . 2,684 parts In-Stock

1+ parts

$8.525

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$6.990

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$6.990

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IDEA Electronic Components Group

UK . 2,265 parts In-Stock

1+ parts

$8.525

100+ parts

$8.099

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$7.672

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2,265

$8.525

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$7.672

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One Stop Electronics

USA . 1,578 parts In-Stock

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$18.500

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Ampacity Inc.

Singapore . 856 parts In-Stock

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$30.500

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$30.500

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Kepictronics

USA . 27,860 parts In-Stock

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Corphita

USA . 2,773 parts In-Stock

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Microchip USA

USA . 988 parts In-Stock

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Perfect Parts

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Overview

Experience superior quality and reliability with the SN65LVDS100DGKG4 by Texas Instruments, a leading manufacturer in the industry. This line driver & receiver offers unparalleled performance and efficiency for a wide range of applications. With its advanced technology and industrial-grade design, this product ensures seamless differential output while maintaining low power consumption. Trust Texas Instruments to deliver innovative solutions that exceed expectations, providing value and benefits to customers seeking top-notch performance. Elevate your projects with the SN65LVDS100DGKG4 and experience unmatched precision and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

With surface mount capability, this product is easy to integrate into circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatility in different power supply configurations, making this product adaptable to various systems.

Package Shape: SQUARE

The square package shape provides a compact design, ideal for applications where space is limited.

Maximum Transmit Delay: 0.8 ns

The low maximum transmit delay ensures fast and efficient data transmission, crucial for high-speed communication systems.

Power Supplies (V): 3.3

The 3.3V power supply offers a common voltage option, making it compatible with many standard electronic devices.

No. of Terminals: 8

The eight terminals provide ample connection points, allowing for versatile wiring options and compatibility with various systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on circuit boards, enabling compact designs in electronic devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption, making this product energy-efficient and cost-effective.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its reliability and lifespan.

Output Characteristics: DIFFERENTIAL

The differential output enables noise rejection and signal integrity, making this product suitable for applications requiring high data accuracy.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function reliably in cold environments, expanding its range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The nickel, palladium, gold, and silver terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections in various environments.

Terminal Position: DUAL

The dual terminal position offers flexibility in wiring configurations, allowing for easy integration into different circuit layouts.

Maximum Seated Height: 1.1 mm

The low maximum seated height contributes to a compact overall design, making this product suitable for slim electronic devices.

Width: 3 mm

The 3mm width offers a compact form factor, enabling this product to be used in space-constrained applications.

Output Polarity: TRUE

The true output polarity simplifies signal interpretation and processing, enhancing the reliability and accuracy of data transmission.

Differential Output: YES

The differential output improves noise immunity and signal integrity, making this product ideal for high-performance communication systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and component reliability during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering in manufacturing, ensuring quality connections for the product.

Length: 3 mm

The 3mm length contributes to a compact design, making this product suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designates this product for use in rugged environments and industrial applications requiring high reliability and durability.

Maximum Receive Delay: 0.8 ns

The low maximum receive delay ensures real-time data reception and processing, critical for applications with stringent timing requirements.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high speed, low power consumption, and reliable operation.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections in various operating conditions.

Interface Standard: EIA-644-A; TIA-644-A

Compliant with the EIA-644-A and TIA-644-A interface standards, this product ensures compatibility and interoperability with industry-standard communication protocols.

Maximum Supply Current: 0.033 mA

The low maximum supply current consumption enhances energy efficiency, reducing power usage and heat generation for improved system performance.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The use of a differential Schmitt trigger for input characteristics ensures reliable signal detection and noise immunity, making this product suitable for high-noise environments.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage provides stable power to the device, ensuring consistent performance in various operating conditions.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch allows for fine-pitch connections, enabling high-density integration in complex electronic systems.

Interface IC Type: LINE TRANSCEIVER

Designed as a line transceiver interface IC type, this product facilitates bidirectional data transmission between different communication networks or devices.

Technical Specifications

Line Drivers & Receivers SN65LVDS100DGKG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644-A; TIA-644-A

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.8 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.033 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.8 ns

Width:

3 mm

Trade Compliance

SN65LVDS100DGKG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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