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SN65LVDS051DR

Texas Instruments

SN65LVDS051DR by Texas Instruments

SN65LVDS051DR by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3V. It features a max transmit delay of 2.7ns and differential output for EIA-644/TIA-644 interface standard applications in industrial settings. With a small outline package style and dual terminal position, it offers reliable performance within an operating temperature range of -40 to 85°C.

Median Price

$2.532

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 37,364 parts In-Stock

1+ parts

$2.911

100+ parts

$2.551

1k+ parts

$1.441

10k+ parts

-

37,364

$2.911

$2.551

$1.441

-

Rochester

USA . 444 parts In-Stock

1+ parts

-

100+ parts

$2.080

1k+ parts

$1.860

10k+ parts

$1.750

444

-

$2.080

$1.860

$1.750

DigiKey

USA . 444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.740

10k+ parts

-

444

-

-

$2.740

-

Verical

USA . 444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.325

10k+ parts

$2.188

444

-

-

$2.325

$2.188

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,688 parts In-Stock

1+ parts

$1.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,688

$1.900

-

-

-

Vyrian

USA . 8,121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,121

-

-

-

-

Elcom Components

USA . 2,377 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,377

-

-

-

-

DigiKey Marketplace

USA . 444 parts In-Stock

1+ parts

-

100+ parts

$2.080

1k+ parts

-

10k+ parts

-

444

-

$2.080

-

-

Semi Source

USA . 114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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114

-

-

-

-

LIBRA Elektronik GmbH

Germany . 57 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

57

-

-

-

-

Inventory MP

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Bristol Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,226 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

4,226

$1.800

-

-

-

Parana Technologies

USA . 1,858 parts In-Stock

1+ parts

$7.019

100+ parts

-

1k+ parts

$7.573

10k+ parts

-

1,858

$7.019

-

$7.573

-

IDEA Electronic Components Group

UK . 2,341 parts In-Stock

1+ parts

$7.886

100+ parts

-

1k+ parts

$7.097

10k+ parts

-

2,341

$7.886

-

$7.097

-

ChromeModa Solutions

Germany . 480 parts In-Stock

1+ parts

$7.886

100+ parts

$6.467

1k+ parts

-

10k+ parts

-

480

$7.886

$6.467

-

-

A-Z Elektronik GmbH

Germany . 6,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,248

-

-

-

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Kepictronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,000

-

-

-

-

DigiPath Technology Company

USA . 525 parts In-Stock

1+ parts

-

100+ parts

$7.110

1k+ parts

-

10k+ parts

-

525

-

$7.110

-

-

Overview

Enhance your electronic designs with the SN65LVDS051DR by Texas Instruments, a top-tier manufacturer known for its quality products. As a line driver and receiver, this component offers impeccable performance and reliability in various applications. With a compact package style and advanced technology, it provides customers with unmatched value, benefits, and advantages, making it the ideal choice for your next project. Trust Texas Instruments to deliver exceptional products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage capability ensures compatibility with a wide range of systems and power sources.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy alignment during assembly, contributing to a streamlined design process.

Maximum Transmit Delay: 2.7 ns

The low maximum transmit delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Power Supplies (V): 3.3

The ability to operate at a standard power supply voltage of 3.3V makes the product compatible with many existing systems and power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the product to be used in a variety of environments and conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function reliably in cold environments or during temperature fluctuations.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Receiver No. of Bits: 2

The receiver's capability to process 2 bits of data simultaneously enhances data processing speed and efficiency, making the product suitable for high-performance applications.

Differential Output: YES

The differential output allows for noise reduction and improved signal integrity, making the product ideal for applications where signal accuracy is crucial.

Technology: BIPOLAR

The use of bipolar technology ensures high speed and reliability in data transmission, making the product suitable for demanding applications that require precision and efficiency.

Interface Standard: EIA-644; TIA-644

Compliance with EIA-644 and TIA-644 interface standards ensures compatibility with industry norms and facilitates easy integration into existing systems.

Technical Specifications

Line Drivers & Receivers SN65LVDS051DR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Maximum Output Low Current:

.02 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.5 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.7 ns

Width:

3.9 mm

Trade Compliance

SN65LVDS051DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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