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SN65LVDM31DG4

Texas Instruments

SN65LVDM31DG4 by Texas Instruments

SN65LVDM31DG4 by Texas Instruments is a CMOS Line Driver with 4 functions, operating at 3.3V. It features a max transmit delay of 2.9ns and supports differential output. Ideal for industrial applications requiring high-speed data transmission in compact designs.

Median Price

$2.663

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 203 parts In-Stock

1+ parts

-

100+ parts

$2.380

1k+ parts

$2.130

10k+ parts

$2.010

203

-

$2.380

$2.130

$2.010

DigiKey

USA . 203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.680

10k+ parts

-

203

-

-

$2.680

-

Verical

USA . 203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.663

10k+ parts

$2.513

203

-

-

$2.663

$2.513

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,544 parts In-Stock

1+ parts

$2.451

100+ parts

-

1k+ parts

-

10k+ parts

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1,544

$2.451

-

-

-

Chip Stock

USA . 15,500 parts In-Stock

1+ parts

-

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-

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15,500

-

-

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Vyrian

USA . 6,078 parts In-Stock

1+ parts

-

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-

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6,078

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 937 parts In-Stock

1+ parts

$2.322

100+ parts

-

1k+ parts

-

10k+ parts

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937

$2.322

-

-

-

Component Stockers USA

USA . 245 parts In-Stock

1+ parts

$2.670

100+ parts

$2.510

1k+ parts

-

10k+ parts

-

245

$2.670

$2.510

-

-

Parana Technologies

USA . 1,652 parts In-Stock

1+ parts

$2.884

100+ parts

-

1k+ parts

$3.376

10k+ parts

-

1,652

$2.884

-

$3.376

-

DigiPath Technology Company

USA . 305 parts In-Stock

1+ parts

$3.176

100+ parts

$2.922

1k+ parts

-

10k+ parts

-

305

$3.176

$2.922

-

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IDEA Electronic Components Group

UK . 1,646 parts In-Stock

1+ parts

$3.241

100+ parts

-

1k+ parts

$2.917

10k+ parts

-

1,646

$3.241

-

$2.917

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ChromeModa Solutions

Germany . 603 parts In-Stock

1+ parts

$3.241

100+ parts

$2.658

1k+ parts

-

10k+ parts

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603

$3.241

$2.658

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-

Microchip USA

USA . 2,169 parts In-Stock

1+ parts

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2,169

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Overview

Enhance your electronic systems with the SN65LVDM31DG4 by Texas Instruments, a top-of-the-line line driver & receiver that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this compact and versatile device is perfect for a wide range of applications. Delivering fast transmission speeds and low power consumption, this product provides exceptional value and performance for customers seeking cutting-edge technology. Upgrade your projects today with the SN65LVDM31DG4 and experience the advantages of superior design and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount option allows for easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power sources, providing flexibility in different operating environments.

No. of Functions: 4

Having multiple functions in a single product helps consolidate circuitry, reducing component count and board size.

Maximum Transmit Delay: 2.9 ns

The low transmit delay ensures fast data transfer, making the product suitable for high-speed communication systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can reliably function in harsh industrial environments without overheating.

Output Characteristics: 3-STATE

The 3-state output feature allows the driver to be disabled or placed in a high-impedance state, offering flexibility in controlling the output signal.

Technology: CMOS

CMOS technology ensures low power consumption and compatibility with a wide range of digital systems, making the product energy-efficient and versatile.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic devices, ensuring compatibility with various systems and components.

Technical Specifications

Line Drivers & Receivers SN65LVDM31DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.27 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.9 ns

Width:

3.9 mm

Trade Compliance

SN65LVDM31DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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