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SN65LVDM22DRG4

Texas Instruments

SN65LVDM22DRG4 by Texas Instruments

SN65LVDM22DRG4 by Texas Instruments is a Line Transceiver with 2 functions, operating at 3.3V nominal voltage. It features EIA-644 and TIA-644 interface standards, differential input characteristics, and 6ns max transmit/receive delay. Ideal for industrial applications requiring high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,992 parts In-Stock

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4,992

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Digiode

USA . 2,628 parts In-Stock

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2,628

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 776 parts In-Stock

1+ parts

$1.500

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776

$1.500

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Parana Technologies

USA . 859 parts In-Stock

1+ parts

$4.909

100+ parts

-

1k+ parts

$5.442

10k+ parts

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859

$4.909

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$5.442

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DigiPath Technology Company

USA . 1,574 parts In-Stock

1+ parts

$5.406

100+ parts

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1,574

$5.406

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ChromeModa Solutions

Germany . 6,226 parts In-Stock

1+ parts

$5.516

100+ parts

$4.523

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6,226

$5.516

$4.523

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IDEA Electronic Components Group

UK . 543 parts In-Stock

1+ parts

$5.516

100+ parts

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$4.964

10k+ parts

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543

$5.516

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$4.964

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AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$19.859

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425

$19.859

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Microchip USA

USA . 5,561 parts In-Stock

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5,561

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Corphita

USA . 1,745 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN65LVDM22DRG4 Line Driver & Receiver. This advanced technology offers seamless communication in industrial applications, ensuring optimal performance and efficiency. With a compact design and high-speed operation, this product provides customers with unmatched value and precision. Trust Texas Instruments for cutting-edge solutions that elevate your systems to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Operates within a wide voltage range, making it compatible with various power sources and systems.

No. of Functions: 2

Having multiple functions in one device saves space on the PCB and simplifies the overall system design.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient utilization of board space and easy integration into existing circuits.

Maximum Transmit Delay: 6 ns

Low transmit delay ensures fast data transmission, critical for applications requiring real-time communication.

No. of Terminals: 16

Having multiple terminals provides flexibility in connecting the device to other components, enhancing compatibility and versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, ideal for compact electronic devices or systems with limited board space.

Minimum Supply Voltage: 3 V

Wide operating voltage range allows for reliable performance even in low voltage conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions or industrial settings.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable performance even in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity, reducing the risk of connectivity issues.

Maximum Seated Height: 1.75 mm

Low seated height allows for a compact and slim design, suitable for space-constrained applications.

Width: 3.9 mm

Narrow width saves space on the PCB, allowing for densely populated circuit boards or compact electronic devices.

Receiver No. of Bits: 2

2-bit receiver provides flexibility in receiving and processing digital signals, suitable for applications requiring data decoding.

Differential Output: YES

Differential output helps reduce electromagnetic interference (EMI) and crosstalk, improving signal quality and reliability.

Length: 9.9 mm

Compact length saves space on the PCB and allows for flexible placement within the system design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding industrial environments with temperature variations.

Maximum Receive Delay: 6 ns

Low receive delay ensures minimal signal latency, critical for real-time data processing and communication.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and mechanical strength, ensuring reliable operation in demanding conditions.

Interface Standard: EIA-644; TIA-644

Complies with industry-standard interface specifications, ensuring compatibility and interoperability with other devices and systems.

Input Characteristics: DIFFERENTIAL

Differential input characteristics improve noise immunity and signal integrity, crucial for reliable data transmission in noisy environments.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage ensures stable and consistent power delivery to the device, optimizing performance and reliability.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for compact PCB layout and integration, ideal for high-density electronic applications.

Driver No. of Bits: 2

2-bit driver enables the transmission of digital signals with precision and accuracy, suitable for high-speed data communication.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type facilitates bidirectional data communication between different systems or devices, enhancing connectivity and interoperability.

Technical Specifications

Line Drivers & Receivers SN65LVDM22DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

6 ns

Width:

3.9 mm

Trade Compliance

SN65LVDM22DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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