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SN65LVDM179DGKR

Texas Instruments

SN65LVDM179DGKR by Texas Instruments

SN65LVDM179DGKR by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 2.7ns max transmit delay, and 8 terminals in a small outline package. Ideal for industrial applications requiring differential output and complementary polarity with a temperature range of -40 to 85°C.

Median Price

$2.907

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,067 parts In-Stock

1+ parts

$2.907

100+ parts

$2.547

1k+ parts

$1.439

10k+ parts

-

25,067

$2.907

$2.547

$1.439

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$1.439

100+ parts

-

1k+ parts

-

10k+ parts

-

36

$1.439

-

-

-

Digiode

USA . 2,325 parts In-Stock

1+ parts

$2.762

100+ parts

-

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-

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2,325

$2.762

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-

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Vyrian

USA . 8,344 parts In-Stock

1+ parts

-

100+ parts

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8,344

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,204 parts In-Stock

1+ parts

$1.439

100+ parts

-

1k+ parts

-

10k+ parts

$1.410

5,204

$1.439

-

-

$1.410

Argo Parts USA

USA . 2,022 parts In-Stock

1+ parts

$1.439

100+ parts

-

1k+ parts

-

10k+ parts

-

2,022

$1.439

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$1.468

100+ parts

$1.468

1k+ parts

$1.468

10k+ parts

-

100

$1.468

$1.468

$1.468

-

Ampacity Inc.

Singapore . 24,613 parts In-Stock

1+ parts

$2.470

100+ parts

-

1k+ parts

-

10k+ parts

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24,613

$2.470

-

-

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Corphita

USA . 4,471 parts In-Stock

1+ parts

$2.616

100+ parts

-

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10k+ parts

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4,471

$2.616

-

-

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Corohmni

South Africa . 712 parts In-Stock

1+ parts

$4.141

100+ parts

-

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712

$4.141

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-

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Parana Technologies

USA . 1,003 parts In-Stock

1+ parts

$9.273

100+ parts

-

1k+ parts

$9.906

10k+ parts

-

1,003

$9.273

-

$9.906

-

ChromeModa Solutions

Germany . 2,411 parts In-Stock

1+ parts

$10.419

100+ parts

$8.544

1k+ parts

-

10k+ parts

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2,411

$10.419

$8.544

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-

IDEA Electronic Components Group

UK . 591 parts In-Stock

1+ parts

$10.419

100+ parts

$9.898

1k+ parts

$9.377

10k+ parts

-

591

$10.419

$9.898

$9.377

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AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$19.360

100+ parts

-

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10k+ parts

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417

$19.360

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A-Z Elektronik GmbH

Germany . 2,111 parts In-Stock

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2,111

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DigiPath Technology Company

USA . 1,419 parts In-Stock

1+ parts

-

100+ parts

$9.394

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10k+ parts

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1,419

-

$9.394

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

$1.367

10k+ parts

$1.338

1,000

-

$1.410

$1.367

$1.338

Kepictronics

USA . 56 parts In-Stock

1+ parts

-

100+ parts

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56

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Overview

Experience unparalleled performance and reliability with the SN65LVDM179DGKR by Texas Instruments, a leading manufacturer in the industry. This line driver/receiver is designed to deliver seamless communication in a variety of applications, ensuring optimal signal transmission and reception. With its advanced technology and quality construction, this product offers customers unmatched value, benefits, and advantages. Trust Texas Instruments to provide you with the innovative solutions you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 3.6 V

This allows for compatibility with a wide range of systems and helps in preventing overloading or damage from voltage spikes.

Maximum Transmit Delay: 2.7 ns

This quick transmit delay ensures efficient communication and data transfer, making the product suitable for high-speed applications.

Output Polarity: COMPLEMENTARY

Complementary outputs provide a balanced signal that helps in reducing noise and interference, resulting in improved signal quality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Technical Specifications

Line Drivers & Receivers SN65LVDM179DGKR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.25 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.7 ns

Width:

3 mm

Trade Compliance

SN65LVDM179DGKR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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