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SN65LVDM1676DGGRG4

Texas Instruments

SN65LVDM1676DGGRG4 by Texas Instruments

SN65LVDM1676DGGRG4 by Texas Instruments is a 16-bit line driver/receiver with differential output, operating at 3.3V. It features a max transmit delay of 3.6ns and can handle up to 175mA supply current. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,713 parts In-Stock

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Digiode

USA . 1,337 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 628 parts In-Stock

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$5.710

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Parana Technologies

USA . 75 parts In-Stock

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$5.887

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$6.671

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$6.671

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ChromeModa Solutions

Germany . 4,734 parts In-Stock

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$6.615

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$5.424

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IDEA Electronic Components Group

UK . 662 parts In-Stock

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$6.615

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$5.954

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662

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One Stop Electronics

USA . 1,237 parts In-Stock

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$25.500

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Component Stockers USA

USA . 448 parts In-Stock

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$99.990

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Corphita

USA . 4,555 parts In-Stock

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Microchip USA

USA . 4,113 parts In-Stock

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DigiPath Technology Company

USA . 1,463 parts In-Stock

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$5.964

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Overview

Experience unparalleled performance and reliability with the SN65LVDM1676DGGRG4 by Texas Instruments, a leading manufacturer in the industry of Line Drivers & Receivers. This versatile product is ideal for a wide range of applications, offering customers exceptional value and benefits. With cutting-edge technology and high-quality materials, this line driver ensures maximum efficiency and functionality. Trust Texas Instruments to deliver top-notch products that exceed expectations and provide seamless solutions for all your needs. Choose the SN65LVDM1676DGGRG4 for superior performance and unmatched quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy are durable materials that provide good protection to the internal components of the product.

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly of the product, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

A higher supply voltage allows for better performance and compatibility with a wide range of systems.

No. of Functions: 16

Having multiple functions packed into one device makes it versatile and cost-effective for various applications.

Maximum Transmit Delay: 3.6 ns

Low transmit delay ensures fast data transmission, making the product suitable for high-speed applications.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with common power sources.

No. of Terminals: 64

Having a high number of terminals allows for complex connections and versatility in circuit design.

Maximum Output Low Current: 8 Amp

High output current capability enables the product to drive loads efficiently and effectively.

Receiver No. of Bits: 16

Having 16 bits for the receiver allows for accurate and detailed data transmission and reception.

Differential Output: YES

Differential output helps in reducing noise and signal interference, ensuring reliable communication.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3V ensures compatibility with standard power sources and systems.

Technical Specifications

Line Drivers & Receivers SN65LVDM1676DGGRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

16

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G64

JESD-609 Code:

e4

Length:

17 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

16

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.5 ns

Receiver No. of Bits:

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

175 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

3.6 ns

Width:

6.1 mm

Trade Compliance

SN65LVDM1676DGGRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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